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STPS2150

P1-P3P4-P6P7-P9
Characteristics STPS2150
4/9
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMAflat)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
I(A)
M
0
1
2
3
4
5
6
1.E-03 1.E-02 1.E-01 1.E+00
T
a
=25°C
T
a
=75°C
T
a
=125°C
I
M
t
δ
=0.5
SMAflat
t(s)
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
DO-15
t (s)
p
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMAflat)
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
t (s)
p
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMAflat
Z/R
th(j-a) th(j-a)
t (s)
p
Figure 11. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
I (µA)
R
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 25 50 75 100 125 150
T =125°C
j
T =150°C
j
T =100°C
j
T =50°C
j
T =25°C
j
T =75°C
j
V (V)
R
C(pF)
10
100
1000
1 10 100 1000
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
STPS2150 Characteristics
5/9
Figure 17. Thermal resistance versus lead length (DO-15)
Figure 13. Forward voltage drop versus
forward current (maximum values,
low level)
Figure 14. Forward voltage drop versus
forward current (maximum values,
high level)
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
I (A)
FM
1
10
100
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMAflat)
R (°C/W)
th(j-a)
0
20
40
60
80
100
120
140
012345
SMA
S (cm²)
Cu
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
SMAflat
R (°C/W)
th(j-a)
S (cm²)
Cu
R (°C/W)
th
0
20
40
60
80
100
120
5 10152025
R
th(j-a)
R
th(j-I)
L (mm)
leads
Package information STPS2150
6/9
2 Package information
● Epoxy meets UL94, V0.
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5. SMA package dimensions
REF.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
Figure 18. SMA footprint dimensions in
millimeters (inches)
Figure 19. Marking information
E
C
L
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)
y w w
e3
z
x x x
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar (
unidirectional
devices only )
P1-P3P4-P6P7-P9

STPS2150

Mfr. #:
Buy STPS2150
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers 2.0 Amp 150 Volt
Lifecycle:
New from this manufacturer.
Delivery:
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