SSL2102 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1.1 — 2 December 2011 11 of 22
NXP Semiconductors
SSL2102
Dimmable Greenchip driver for LED lighting
[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[2] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 series
resistor.
[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
10. Thermal characteristics
The heat sink for SSL2102 applications is provided by the Printed-Circuit Board (PCB)
copper. The SSL2102 uses thermal leads (pins 2, 3, 6, 7,16, 17, 18 and 19) for heat
transfer from the die to PCB.
Enhanced thermal lead connection may drastically reduce thermal resistance.
The following equation shows the relationship between the maximum allowable power
dissipation P and the thermal resistance from junction to ambient.
Where:
R
th(j-a)
= thermal resistance from junction to ambient
T
j(max)
= maximum junction temperature
T
amb
= ambient temperature
P = power dissipation
The thermal resistance as a function of the PCB area (Board: 0.8 mm thickness, 2 layers,
Bottom Cu coverage 90 %, Cu thickness 70 m
(390 W/mK), Core material conductivity: 0.5 W/mK, 10 vias dia 0.3 mm) is shown in
Figure 8
V
ESD
electrostatic discharge voltage human body
model;
[1]
Pins 20, 1, 4 1000 +1000 V
All other pins 2000 +2000 V
machine model
[2]
200 +200 V
charged device
model
[3]
500 +500 V
Table 4. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground; positive currents flow into the device; pins V
CC
and RC cannot be current
driven. Pins ISENSE and AUX cannot be voltage driven.
Symbol Parameter Conditions Min Max Unit
R
th j a–
T
jmax
T
amb
–P=
