2
Technical Data 10477
Effective November 2015
FP1309B
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number
7
OCL
1
(nH)±10%
FLL
2
(nH) minimum
I
rms
3
(amps)
I
sat
1
4
(amps)
I
sat
2
5
(amps)
DCR (mΩ)
±5% @ 20°C K-factor
6
B1 version
FP1309B1-R100-R 100 72 60 100 80 0.19 296
FP1309B1-R120-R 120 87 60 90 72 0.19 296
FP1309B1-R150-R 150 108 60 80 64 0.19 296
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I
sat
1, +25°C
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end application.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25°C
5. I
sat
2: Peak current for approximately 20% rolloff @ +125°C
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10
-3
. Bp-p:(Gauss),
K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).
7. Part Number Definition: FP1309Bx-Rxxx-R
FP1309B= Product code and size
x= Version indicator
Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: FP1309Bx (Product code and size, x = version indicator),
Rxxx = Inductance value in uH, R = decimal point
wwllyy = date code, R = revision level
All soldering surface to be coplanar within 0.10mm
DCR measured between point “a” and point “b”
Recommended Pad Layout
