NVMFD5C462NLT1G

© Semiconductor Components Industries, LLC, 2015
August, 2017 Rev. P3
1 Publication Order Number:
NVMFD5C462NL/D
NVMFD5C462NL
Power MOSFET
40 V, 4.7 mW, 84 A, Dual NChannel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFD5C462NLWF Wettable Flank Option for Enhanced Optical
Inspection
AECQ101 Qualified and PPAP Capable
These Devices are PbFree and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DraintoSource Voltage V
DSS
40 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
JC
(Notes 1, 2, 3)
Steady
State
T
C
= 25°C
I
D
84
A
T
C
= 100°C 52
Power Dissipation
R
JC
(Notes 1, 2)
T
C
= 25°C
P
D
50
W
T
C
= 100°C 25
Continuous Drain
Current R
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
18
A
T
A
= 100°C 15
Power Dissipation
R
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.0
W
T
A
= 100°C 2.1
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 s
I
DM
311 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+ 175
°C
Source Current (Body Diode) I
S
56 A
Single Pulse DraintoSource Avalanche
Energy (T
J
= 25°C, I
L(pk)
= 5 A)
E
AS
174 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase Steady State
R
JC
2.25
°C/W
JunctiontoAmbient Steady State (Note 2)
R
JA
47.3
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surfacemounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
40 V
4.7 m @ 10 V
84 A
7.7 m @ 4.5 V
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
D1
D1
D2
D2
S1
G1
S2
G2
Dual NChannel
D1
S1
G1
XXXXXX
AYWZZ
D2
D1
D2
S2
G2
D2
D1
DFN8 5x6
(SO8FL)
CASE 506BT
1
NVMFD5C462NL
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 A
40 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
29
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 40 V
T
J
= 25 °C 10
A
T
J
= 125°C 100
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 40 A
1.2 2.2 V
Negative Threshold Temperature Coefficient V
GS(TH)
/T
J
5.0 mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V I
D
= 10 A 3.9 4.7
m
V
GS
= 4.5 V I
D
= 10 A 6.4 7.7
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 10 A 70 S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
1300
pF
Output Capacitance C
OSS
530
Reverse Transfer Capacitance C
RSS
22
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 32 V; I
D
= 25 A 11
nC
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 32 V; I
D
= 25 A 23
Threshold Gate Charge Q
G(TH)
V
GS
= 4.5 V, V
DS
= 32 V; I
D
= 10 A
3.4
GatetoSource Charge Q
GS
4.7
GatetoDrain Charge Q
GD
3
Plateau Voltage V
GP
3.4 V
SWITCHING CHARACTERISTICS (Note 5)
TurnOn Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 32 V,
I
D
= 5 A, R
G
= 1.0
11
ns
Rise Time t
r
16
TurnOff Delay Time t
d(OFF)
19
Fall Time t
f
6
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 10 A
T
J
= 25°C 0.86 1.2
V
T
J
= 125°C 0.75
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 25 A/s,
I
S
= 5 A
29
ns
Charge Time t
a
14
Discharge Time t
b
14
Reverse Recovery Charge Q
RR
12 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 s, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NVMFD5C462NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAINTOSOURCE VOLTAGE (V) V
GS
, GATETOSOURCE VOLTAGE (V)
1.51.00.50
0
7
35
14
21
70
91
4.52.52.01.00
0
20
40
60
70
100
Figure 3. OnResistance vs. GatetoSource
Voltage
Figure 4. OnResistance vs. Drain Current and
Gate Voltage
V
GS
, GATETOSOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
1098765
0
5
35
4025105
4
5
9
Figure 5. OnResistance Variation with
Temperature
Figure 6. DraintoSource Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAINTOSOURCE VOLTAGE (V)
12510075502502550
1.1
1.3
1.5
1.7
2.1
40302520105
0.1
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (m)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (NORMALIZED)
I
DSS
, LEAKAGE (nA)
10 to 6.5 V
4.5 V
3.8 V
3.6 V
3.4 V
V
GS
= 3.2 V
V
DS
= 10 V
T
J
= 125°C
T
J
= 55°C
T
J
= 25°C
20
25
50
I
D
= 10 A
T
J
= 25°C
35 45
3
7
T
J
= 25°C
V
GS
= 4.5 V
V
GS
= 10 V
I
D
= 10 A
V
GS
= 10 V
T
J
= 125°C
T
J
= 175°C
T
J
= 25°C
15 35
10
100
1K
10K
R
DS(on)
, DRAINTOSOURCE RESISTANCE (m)
90
43
175
1.9
3.02.52.0 3.00.5
0.9
0.7
150
56
80
30
10
55
6
8
T
J
= 85°C
28
49
63
84
1.5 3.5
10
40
T
J
= 150°C
1
100K
42
77
15
30
45
0.01
15
50
4.0
3020 50

NVMFD5C462NLT1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET T6 40V LL S08FL DS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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