CREAT BY ART
- Ideal for automated placement, for compact PCB design
- High surge current capability
- Ultrafast reverse recovery time for high frequency
- Negligible leakage current
- Halogen-free according to IEC 61249-2-21
Molding compound, UL flammability classification rating 94V-0
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL UNIT
V
RRM
V
V
RMS
V
V
DC
V
I
F(AV)
A
t
rr
ns
I
2
tA
2
s
T
J
°C
T
STG
°C
Document Number: DS_D1412015 Version: C15
T
J
=25°C
1.5A, 1000V
RABS15M
Taiwan Semiconductor
Miniature Fast Recover
Glass Passivated Surface Brid
e Rectifier
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Molded plastic body
Polarity: Polarity as marked on the body
Weight: 0.09 g (approximately)
Rating for fusing (t<8.3ms)
Maximum instantaneous forward voltage (Note 1)
I
F
= 1.5A
Maximum reverse current @ rated V
R
T
J
=125°C
- 55 to +150
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I
FSM
50
R
θJL
R
θJA
Moisture sensitivity: level 1, per J-STD-020
10
Typical thermal resistance
1
I
R
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
ABS-L
A
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 1.5
V
F
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Operating junction temperature range
70
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
μA
200
26
Maximum reverse recovery time per diode (Note 2)
- 55 to +150
V
°C/W
RABS15M
500
1.30
1000
700
1000
1
23
4
1
23
4
