RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
www.semtech.com
5 of 9
Semtech
Application Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech’s recommended assembly guidelines for
mounting this device. The gure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
aect the assembly process. The exact manufacturing
parameters will require some experimentation to get the
desired solder application.
Assembly Parameter Recommendation
Solder Stencil Design Laser cut, Electro-polished
Aperture shape Rectangular
Solder Stencil Thickness 0.100 mm (0.004”)
Solder Paster Type Type 4 size sphere or smaller
Solder Reow Prole Per JEDEC J-STD-020
PCB Solder Pad Design Non-Solder mask dened
PCB Pad Finish OSP Or NiAu
All Dimensions are in mm.
Component
Land Pad.
Stencil opening
0.250
0.025
0.450
0.025
0.020
0.450
0.500
0.180
0.250
0.800
1.300
Recommended Mounting Pattern
