January 2008 Rev 2 1/13
13
STD30PF03LT4
STD30PF03L-1
P-channel 30 V - 0.025 - 24 A - DPAK / IPAK
STripFET™ II Power MOSFET
Features
Standard outline for easy automated surface
mount assembly
Low threshold device
Low gate charge
Application
Switching applications
Description
This Power MOSFET is the latest development of
STMicroelectronics unique “single feature size”
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance and low gate charge.
Figure 1. Internal schematic diagram
Type V
DSS
R
DS(on)
max I
D
STD30PF03LT4 30 V < 0.028 24 A
STD30PF03L-1 30 V < 0.028 24 A
DPAK
1
3
3
2
1
IPAK
Table 1. Device summary
Order codes Marking Package Packaging
STD30PF03LT4 D30PF03L DPAK Tape & reel
STD30PF03L-1 D30PF03L IPAK Tube
www.st.com
Electrical ratings STD30PF03LT4 - STD30PF03L-1
2/13
1 Electrical ratings
Table 2. Absolute maximum ratings
Note: For the p-channel Power MOSFET actual polarity of voltages and current has to be reversed
Symbol Parameter Value Unit
V
DS
Drain-source voltage (V
GS
=0)
30 V
V
GS
Gate-source voltage ± 16 V
I
D
(1)
1. Current limited by wire bonding
Drain current (continuous) at T
C
= 25 °C
24 A
I
D
(1)
Drain current (continuous) at T
C
= 100 °C
24 A
I
DM
(2)
2. Pulse width limited by safe operating area
Drain current (pulsed) 96 A
P
TOT
Total dissipation at T
C
=25 °C
70 W
Derating factor 0.47 W/°C
E
AS
(3)
3. Starting T
J
= 25 °C, I
D
= 12 A, V
DD
=15 V
Single pulse avalanche energy 850 mJ
T
stg
Storage temperature -55 to 175 °C
T
j
Max. operating junction temperature 175 °C
Table 3. Thermal data
Symbol Parameter
Max value
Unit
DPAK IPAK
R
thj-case
Thermal resistance junction-case max 2.14 °C/W
R
thj-amb
Thermal resistance junction-ambient max -- 100 °C/W
R
thj-pcb
Thermal resistance junction-pcb max
50
(1)
1. When mounted on FR- 4board of 1 inch².
-- °C/W
T
l
Maximum lead temperature for soldering purpose -- 275 °C/W
STD30PF03LT4 - STD30PF03L-1 Electrical characteristics
3/13
2 Electrical characteristics
(T
CASE
=25 °C unless otherwise specified)
Note: For the p-channel Power MOSFET actual polarity of voltages and current has to be reversed
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source breakdown
voltage
I
D
= 250 µA, V
GS
= 0
30 V
I
DSS
Zero gate voltage drain
current (V
GS
= 0)
V
DS
=Max rating
V
DS
=Max rating,Tc=100 °C
1
10
µA
µA
I
GSS
Gate body leakage current
(V
DS
= 0)
V
GS
= ±16 V
±100 nA
V
GS(th)
Gate threshold voltage
V
DS
= V
GS
, I
D
= 250 µA
1V
R
DS(on)
Static drain-source on
resistance
V
GS
= 10 V, I
D
= 12 A
V
GS
= 5 V, I
D
= 12 A
0.025
0.032
0.028
0.040
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
g
fs
(1)
1. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Forward transconductance
V
DS
=15 V, I
D
= 12 A
23 S
C
iss
C
oss
C
rss
Input capacitance
Output capacitance
Reverse transfer
capacitance
V
DS
=25 V, f=1MHz, V
GS
=0
1670
345
120
pF
pF
pF
Q
g
Q
gs
Q
gd
Total gate charge
Gate-source charge
Gate-drain charge
V
DD
=15 V, I
D
= 24 A
V
GS
=5 V
Figure 15
18.6
5.5
11
28 nC
nC
nC

STD30PF03LT4

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET P-CH 30V 24A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet