MC74ACT574DWR2G

MC74AC574, MC74ACT574
http://onsemi.com
7
ORDERING INFORMATION
Device Package Shipping
MC74AC574N PDIP−20
18 Units / Rail
MC74AC574NG PDIP−20
(Pb−Free)
MC74ACT574N PDIP−20
MC74ACT574NG PDIP−20
(Pb−Free)
MC74AC574DW SOIC−20
38 Units / Rail
MC74AC574DWG SOIC−20
(Pb−Free)
MC74AC574DWR2 SOIC−20
1000 / Tape & Reel
MC74AC574DWR2G SOIC−20
(Pb−Free)
MC74ACT574DW SOIC−20
38 Units / Rail
MC74ACT574DWG SOIC−20
(Pb−Free)
MC74ACT574DWR2 SOIC−20
1000 / Tape & Reel
MC74ACT574DWR2G SOIC−20
(Pb−Free)
MC74AC574DTR2 TSSOP−20*
2500 / Tape & Reel
MC74AC574DTR2G TSSOP−20*
MC74ACT574DTR2 TSSOP−20*
2500 / Tape & Reel
MC74ACT574DTR2G TSSOP−20*
MC74AC574M SOEIAJ−20
40 Units / Rail
MC74AC574MG SOEIAJ−20
(Pb−Free)
MC74AC574MEL SOEIAJ−20
2000 / Tape & Reel
MC74AC574MELG SOEIAJ−20
(Pb−Free)
MC74ACT574M SOEIAJ−20
40 Units / Rail
MC74ACT574MG SOEIAJ−20
(Pb−Free)
MC74ACT574MEL SOEIAJ−20
2000 / Tape & Reel
MC74ACT574MELG SOEIAJ−20
(Pb−Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
MC74AC574, MC74ACT574
http://onsemi.com
8
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J 20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M 0 15 0 15
N 0.51 1.010.020 0.040
____
E
1.27 1.770.050 0.070
1
11
10
20
−A−
SEATING
PLANE
K
N
FG
D 20 PL
−T−
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
1
11
10
B20X
H10X
C
L
18X
A1
A
SEATING
PLANE
q
h X 45
_
E
D
M
0.25
M
B
M
0.25
S
A
S
B
T
e
T
B
A
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
MC74AC574, MC74ACT574
http://onsemi.com
9
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/22X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
−−− −−−
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

MC74ACT574DWR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Flip Flops 5V CMOS Octal D-Type 3-State Out
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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