LTC6088HGN#TRPBF Datasheet LTC6087CDD#PBF, LTC6088CDHC#PBF, LTC6087CMS8#PBF | P13-P15

LTC6087/LTC6088

60878fc

package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

GN16 REV B 0212

1 2

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

.189 – .196*

(4.801 – 4.978)

12 11 10

.016 – .050

(0.406 – 1.270)

.015 ±.004

(0.38 ±0.10)

× 45°

0° – 8° TYP

.007 – .0098

(0.178 – 0.249)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.009

(0.229)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC.0165 ±.0015

.045 ±.005

* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641 Rev B)

LTC6087/LTC6088

60878fc

package Description

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

3.00 ±0.10

(2 SIDES)

5.00 ±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC

PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ±0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

R = 0.20

TYP

4.40 ±0.10

(2 SIDES)

169

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DHC16) DFN 1103

0.25 ±0.05

PIN 1

NOTCH

0.50 BSC

4.40 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)2.20 ±0.05

0.50 BSC

0.65 ±0.05

3.50 ±0.05

PACKAGE

OUTLINE

0.25 ± 0.05

DHC Package

16-Lead Plastic DFN (5mm × 3mm)

(Reference LTC DWG # 05-08-1706 Rev Ø)

LTC6087/LTC6088

60878fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

revision history

REV DATE DESCRIPTION PAGE NUMBER

C 7/12 Corrected Supply Current value.

Provided V

condition for GBW specification.

4, 5

(Revision history begins at Rev C)

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P16

LTC6088HGN#TRPBF

Mfr. #:

Buy LTC6088HGN#TRPBF

Manufacturer:

Analog Devices Inc.

Description:

Precision Amplifiers 4x 14MHz, R2R CMOS Amps

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

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LTC6088HGN#TRPBF

LTC6088HGN#TRPBF

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