RJL6020DPK-00#T0

RJL6020DPK
REJ03G1618-0300 Rev.3.00 Jan 22, 2010
Page 2 of 6
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown voltage V
(BR)DSS
600 V I
D
= 10 mA, V
GS
= 0
Zero gate voltage drain current I
DSS
10 μA V
DS
= 600 V, V
GS
= 0
Gate to source leak current I
GSS
±0.1 μA V
GS
= ±30 V, V
DS
= 0
Gate to source cutoff voltage V
GS(off)
1.5 — 4.0 V V
DS
= 10 V, I
D
= 1 mA
Static drain to source on state
resistance
R
DS(on)
0.17 0.21 Ω I
D
= 15 A, V
GS
= 10 V
Note4
Input capacitance Ciss 4750 pF
Output capacitance Coss 465 pF
Reverse transfer capacitance Crss 53 pF
V
DS
= 25 V
V
GS
= 0
f = 1 MHz
Turn-on delay time t
d(on)
— 44 — ns
Rise time t
r
— 64 — ns
Turn-off delay time t
d(off)
206 ns
Fall time t
f
121 ns
I
D
= 15 A
V
GS
= 10 V
R
L
= 20 Ω
Rg = 10 Ω
Total gate charge Qg 130 nC
Gate to source charge Qgs 21 nC
Gate to drain charge Qgd 53 nC
V
DD
= 480 V
V
GS
= 10 V
I
D
= 30 A
Body-drain diode forward voltage V
DF
0.96 1.60 V I
F
= 30 A, V
GS
= 0
Note4
Body-drain diode reverse recovery time t
rr
180 ns
I
F
= 30 A, V
GS
= 0
di
F
/dt = 100 A/μs
Notes: 4. Pulse test
RJL6020DPK
REJ03G1618-0300 Rev.3.00 Jan 22, 2010
Page 3 of 6
Main Characteristics
50
40
30
20
10
0
4 8 12 16 20
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Typical Output Characteristics
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
Typical Transfer Characteristics
1 10010
0.1
1
0.01
Drain Current I
D
(A)
Drain to Source on State Resistance
R
DS(on)
()
Static Drain to Source on State Resistance
vs. Drain Current (Typical)
Drain to Source Voltage V
DS
(V)
Drain Current I
D
(A)
Maximum Safe Operation Area
Case Temperature Tc (°C)
Static Drain to Source on State Resistance
R
DS(on)
()
Static Drain to Source on State Resistance
vs. Temperature (Typical)
02 46810
100
1
10
0.1
0
0.1
0.2
0.5
0.4
0.3
0.6
-25 0 5025 75 100 125 150
0.01
0.1
1
10
100
1000
0.1 1 10 100 1000
Tc = 25°C
1 shot
Operation in this
area is limited by
R
DS(on)
1 10 100
1000
100
10
Reverse Drain Current I
DR
(A)
Reverse Recovery Time t
rr
(ns)
Body-Drain Diode Reverse
Recovery Time (Typical)
di / dt = 100 A / µs
V
GS
= 0, Ta = 25°C
10
µ
s
PW = 100
µs
V
GS
= 10 V
Pulse Test
3 A, 10 A
I
D
= 30 A
V
DS
= 10 V
Pulse Test
Tc = 75°C
25°C
25°C
V
GS
= 10 V
Ta = 25°C
Pulse Test
15 A
4.2 V
4.4 V
4.6 V
4.8 V
V
GS
= 4 V
Ta = 25°C
Pulse Test
5 V
7 V
10 V
RJL6020DPK
REJ03G1618-0300 Rev.3.00 Jan 22, 2010
Page 4 of 6
800
0
16
600 12
400 8
200 4
40 80 120 160 200
0
Capacitance C (pF)
Drain to Source Voltage V
DS
(V)
Typical Capacitance vs.
Drain to Source Voltage
Gate Charge Qg (nC)
Drain to Source Voltage V
DS
(V)
Gate to Source Voltage V
GS
(V)
Dynamic Input Characteristics (Typical)
0
0.4 0.81.21.62.0
50
20
Source to Drain Voltage V
SD
(V)
Reverse Drain Current vs.
Source to Drain Voltage (Typical)
Reverse Drain Current I
DR
(A)
Case Temperature Tc (°C)
Gate to Source Cutoff Voltage
vs. Case Temperature (Typical)
Gate to Source Cutoff Voltage V
GS(off)
(V)
10
30
40
0
5
-25 0 25 50 75 100 125
150
2
1
3
4
V
DS
V
GS
V
DD
= 480 V
300 V
100 V
V
DD
= 100 V
300 V
480 V
V
DS
= 10 V
1 mA
I
D
= 30 A
Ta = 25 °C
V
GS
= 0 V
Pulse Test
Ta = 25 °C
0200100 300
100000
10000
100
1000
10
Ciss
Coss
Crss
V
GS
= 0
f = 1 MHz
Ta = 25°C
I
D
= 10 mA

RJL6020DPK-00#T0

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
MOSFET MOSFET - Lead Free
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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