Figure 4: 78-Ball FBGA – x4, x8; Die Rev. D (HX)
0.8 TYP
9.6 CTR
11.5 ±0.1
0.8 TYP
6.4 CTR
9 ±0.1
Ball A1 ID
Ball A1 ID
A
B
C
D
E
F
G
H
J
K
L
M
N
123789
78X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
A 0.12 A
Seating plane
1.1 ±0.1
0.25 MIN
1.8 CTR
Nonconductive
overmold
0.155
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% SN, 3% Ag, 0.5% Cu).
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Package Dimensions
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Figure 5: 96-Ball FBGA – x16; Die Rev. D (HA)
Ball A1 ID
Seating
plane
0.8 ±0.1
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
0.12
A
A
14 ±0.15
0.8 TYP
1.2 MAX
12 CTR
Ball A1 ID
0.8 TYP
9 ±0.15
0.25 MIN6.4 CTR
96X Ø0.45
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note:
1. All dimensions are in millimeters.
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Package Dimensions
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Electrical Characteristics – I
DD
Specifications
Table 5: I
DD
Maximum Limits – Rev. D
Speed Bin
DDR3L-800 DDR3L-1066 DDR3L-1333 UnitsI
DD
Width
I
DD0
x4, 8 70 75 85 mA
x16 85 90 100 mA
I
DD1
x4, 8 92 95 100 mA
x16 122 125 130 mA
I
DD2P0
All 12 12 12 mA
I
DD2P1
x4, 8 22 25 30 mA
x16 27 30 35 mA
I
DD2Q
All 27 30 35 mA
I
DD2N
All 28 32 37 mA
I
DD2NT
x4, 8 37 40 45 mA
x16 52 55 60 mA
I
DD3P
x4, 8 27 30 35 mA
x16 32 35 40 mA
I
DD3N
All 32 35 40 mA
I
DD4R
x4 110 125 145 mA
x8 125 140 160 mA
x16 160 200 245 mA
I
DD4W
x4 120 135 155 mA
x8 130 145 165 mA
x16 170 210 255 mA
I
DD5B
All 185 190 200 mA
I
DD6
All 12 12 12 mA
I
DD6ET
All 15 15 15 mA
I
DD7
x4, 8 290 335 385 mA
x16 330 375 425 mA
I
DD8
All I
DD2P0
+ 2mA I
DD2P0
+ 2mA I
DD2P0
+ 2mA mA
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Electrical Characteristics – I
DD
Specifications
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.

MT41K256M8HX-15E:D

Mfr. #:
Manufacturer:
Micron
Description:
IC DRAM 2G PARALLEL 78FBGA
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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