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MT41K256M8HX-15E:D
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P23
Figure 4: 78-Ball FBGA – x4, x8; Die Rev. D (HX)
0.8 TYP
9.6 CTR
11.5 ±0.1
0.8 TYP
6.4 CTR
9 ±0.1
Ball A1 ID
Ball A1 ID
A
B
C
D
E
F
G
H
J
K
L
M
N
1
2
3
7
8
9
78X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
A
0.12
A
Seating plane
1.1 ±0.1
0.25 MIN
1.8 CTR
Nonconductive
overmold
0.155
Notes:
1.
All dimensions are in millimeters.
2.
Solder ball material: SAC305 (96.5% SN, 3% Ag, 0.5% Cu).
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Package Dimensions
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2010 Micron Technology, Inc. All rights reserved.
Figure 5: 96-Ball FBGA – x16; Die Rev. D (HA)
Ball A1 ID
Seating
plane
0.8 ±0.1
Solder ball
material: SAC305.
Dimensions
apply to solder
balls post-reflow
on Ø0.35 SMD
ball pads.
0.12
A
A
14 ±0.15
0.8 TYP
1.2 MAX
12 CTR
Ball A1 ID
0.8 TYP
9 ±0.15
0.25 MIN
6.4 CTR
96X Ø0.45
9
8
7
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note:
1.
All dimensions are in millimeters.
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Package Dimensions
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2010 Micron Technology, Inc. All rights reserved.
Electrical Characteristics – I
DD
Specifications
Table 5: I
DD
Maximum Limits – Rev. D
Speed Bin
DDR3L-800
DDR3L-1066
DDR3L-1333
Units
I
DD
Width
I
DD0
x4, 8
70
75
85
mA
x16
85
90
100
mA
I
DD1
x4, 8
92
95
100
mA
x16
122
125
130
mA
I
DD2P0
All
12
12
12
mA
I
DD2P1
x4, 8
22
25
30
mA
x16
27
30
35
mA
I
DD2Q
All
27
30
35
mA
I
DD2N
All
28
32
37
mA
I
DD2NT
x4, 8
37
40
45
mA
x16
52
55
60
mA
I
DD3P
x4, 8
27
30
35
mA
x16
32
35
40
mA
I
DD3N
All
32
35
40
mA
I
DD4R
x4
110
125
145
mA
x8
125
140
160
mA
x16
160
200
245
mA
I
DD4W
x4
120
135
155
mA
x8
130
145
165
mA
x16
170
210
255
mA
I
DD5B
All
185
190
200
mA
I
DD6
All
12
12
12
mA
I
DD6ET
All
15
15
15
mA
I
DD7
x4, 8
290
335
385
mA
x16
330
375
425
mA
I
DD8
All
I
DD2P0
+ 2mA
I
DD2P0
+ 2mA
I
DD2P0
+ 2mA
mA
2Gb: x4, x8, x16 DDR3L SDRAM Addendum
Electrical Characteristics – I
DD
Specifications
PDF: 09005aef83ed2952
2Gb_1_35V_DDR3L.pdf - Rev. E 1/11 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2010 Micron Technology, Inc. All rights reserved.
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P23
MT41K256M8HX-15E:D
Mfr. #:
Buy MT41K256M8HX-15E:D
Manufacturer:
Micron
Description:
IC DRAM 2G PARALLEL 78FBGA
Lifecycle:
New from this manufacturer.
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