NTD4979NT4G

© Semiconductor Components Industries, LLC, 2012
January, 2012 Rev. 0
1 Publication Order Number:
NTD4979N/D
NTD4979N
Power MOSFET
30 V, 41 A, Single NChannel, DPAK/IPAK
Features
Low R
DS(on)
to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Three Package Variations for Design Flexibility
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
CPU Power Delivery
DCDC Converters
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter Symbol Value Unit
DraintoSource Voltage V
DSS
30 V
GatetoSource Voltage V
GS
±20 V
Continuous Drain
Current R
q
JA
(Note 1)
Steady
State
T
A
= 25°C
I
D
12.7
A
T
A
= 100°C 9.0
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
2.56 W
Continuous Drain
Current R
q
JA
(Note 2)
T
A
= 25°C
I
D
9.4
A
T
A
= 100°C 6.6
Power Dissipation
R
q
JA
(Note 2)
T
A
= 25°C P
D
1.38 W
Continuous Drain
Current R
q
JC
(Note 1)
T
C
= 25°C
I
D
41
A
T
C
= 100°C 29
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C P
D
26.3 W
Pulsed Drain
Current
t
p
=10ms
T
A
= 25°C I
DM
150 A
Current Limited by Package T
A
= 25°C I
DmaxPkg
40 A
Operating Junction and Storage
Temperature
T
J
,
T
STG
55 to
+175
°C
Source Current (Body Diode) I
S
24 A
Drain to Source dV/dt dV/dt 6.0 V/ns
Single Pulse DraintoSource Avalanche
Energy (T
J
= 25°C, V
DD
= 24 V, V
GS
= 10 V,
I
L
= 19 A
pk
, L = 0.1 mH, R
G
= 25 W)
EAS 18 mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
MARKING DIAGRAMS
& PIN ASSIGNMENTS
http://onsemi.com
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
30 V
9.0 mW @ 10 V
41 A
19 mW @ 4.5 V
G
S
NCHANNEL MOSFET
D
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
YWW
49
79NG
1
Gate
2
Drain
3
Source
4
Drain
4
Drain
2
Drain
1
Gate
3
Source
4
Drain
2
Drain
1
Gate
3
Source
YWW
49
79NG
YWW
49
79NG
Y = Year
WW = Work Week
4979N = Device Code
G = PbFree Package
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
CASE 369D
IPAK
(Straight Lead
DPAK)
1
2
3
4
1
2
3
4
CASE 369AC
3 IPAK
(Straight Lead)
1
2
3
4
NTD4979N
http://onsemi.com
2
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
JunctiontoCase (Drain)
R
q
JC
5.7
°C/W
JunctiontoTAB (Drain)
R
q
JCTAB
4.3
JunctiontoAmbient – Steady State (Note 3)
R
q
JA
58.6
JunctiontoAmbient – Steady State (Note 4)
R
q
JA
108.6
3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
4. Surfacemounted on FR4 board using the minimum recommended pad size.
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
DraintoSource Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
30 V
DraintoSource Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
17
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 24 V
T
J
= 25°C 1.0
mA
T
J
= 125°C 10
GatetoSource Leakage Current I
GSS
V
DS
= 0 V, V
GS
= ±20 V ±100 nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.5 1.8 2.5 V
Negative Threshold Temperature
Coefficient
V
GS(TH)
/T
J
4.5
mV/°C
DraintoSource On Resistance R
DS(on)
V
GS
= 10 V
I
D
= 30 A 6.9 9.0
mW
I
D
= 15 A 6.9
V
GS
= 4.5 V
I
D
= 30 A 13.6 19
I
D
= 15 A 13.2
Forward Transconductance g
FS
V
DS
= 1.5 V, I
D
= 30 A 36 S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1.0 MHz, V
DS
= 15 V
837
pF
Output Capacitance C
OSS
347
Reverse Transfer Capacitance C
RSS
180
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 15 V, I
D
= 30 A
9.0
nC
Threshold Gate Charge Q
G(TH)
1.42
GatetoSource Charge Q
GS
2.8
GatetoDrain Charge Q
GD
4.8
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 15 V, I
D
= 30 A 16.5 nC
SWITCHING CHARACTERISTICS (Note 6)
TurnOn Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 15 V,
I
D
= 15 A, R
G
= 3.0 W
10
ns
Rise Time t
r
27
TurnOff Delay Time t
d(OFF)
13.3
Fall Time t
f
6.4
5. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
7. Assume terminal length of 110 mils.
NTD4979N
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter UnitMaxTypMinTest ConditionSymbol
SWITCHING CHARACTERISTICS (Note 6)
TurnOn Delay Time
t
d(ON)
V
GS
= 10 V, V
DS
= 15 V,
I
D
= 15 A, R
G
= 3.0 W
6.5
ns
Rise Time t
r
20.2
TurnOff Delay Time t
d(OFF)
17.2
Fall Time t
f
4.2
DRAINSOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 30 A
T
J
= 25°C 0.91 1.1
V
T
J
= 125°C 0.82
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 30 A
20.8
ns
Charge Time t
a
9.8
Discharge Time t
b
11
Reverse Recovery Charge Q
RR
8.0 nC
PACKAGE PARASITIC VALUES
Source Inductance (Note 7)
L
S
T
A
= 25°C
2.85
nH
Drain Inductance, DPAK L
D
0.0164
Drain Inductance, IPAK (Note 7) L
D
1.88
Gate Inductance (Note 7) L
G
4.9
Gate Resistance R
G
1.0 2.2
W
5. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
6. Switching characteristics are independent of operating junction temperatures.
7. Assume terminal length of 110 mils.
ORDERING INFORMATION
Device Package Shipping
NTD4979NT4G DPAK
(PbFree)
2500 / Tape & Reel
NTD4979N1G IPAK
(PbFree)
75 Units / Rail
NTD4979N35G IPAK Trimmed Lead
(PbFree)
75 Units / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

NTD4979NT4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IGBT Transistors MOSFET NFET DPAK 30V 41A 9MOHM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet