NCV4299C
www.onsemi.com
4
MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage to Regulator (DC) V
I
−40 45 V
Input Peak Transient Voltage to Regulator wrt GND (Note 1) − − 60 V
Inhibit (INH) V
INH
−40 45 V
Sense Input (SI) V
SI
−40 45 V
Sense Input (SI) I
SI
−1.0 1.0 mA
Reset Threshold (RADJ) V
RADJ
−0.3 7.0 V
Reset Threshold (RADJ) I
RADJ
−10 10 mA
Reset Delay (D) V
D
−0.3 7.0 V
Reset Output (RO) V
RO
−0.3 7.0 V
Reset Output (RO) I
RO
−20 20 mA
Sense Output (SO) V
SO
−0.3 7.0 V
Output (Q) V
Q
−0.3 16 V
Output (Q) I
Q
−5.0 − mA
ESD Capability, Human Body Model (Note 3) ESD
HB
2.0 − kV
ESD Capability, Machine Model (Note 3) ESD
MM
200 − V
ESD Capability, Charged Device Model (Note 3) ESD
CDM
1.0 − kV
Junction Temperature T
J
− 150 °C
Storage Temperature T
stg
−50 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING RANGE
Input Voltage 5.0 V Version
3.3 V Version
V
I
5.5
4.4
45
45
V
Junction Temperature T
J
−40 150 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
LEAD TEMPERATURE SOLDERING REFLOW (Note 2)
Reflow (SMD styles only), lead free 60 s−150 sec above 217, 40 sec max at peak
T
SLD
− 265 Pk °C
Moisture Sensitivity Level SO−8
SO−14
MSL Level 1
Level 1
1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class C according to ISO16750−1
2. Per
IPC / JEDEC J−STD−020C.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (JS−001−2010)
ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD CDM tested per AEC−Q100−011 (EIA/JESD22−C101).
THERMAL CHARACTERISTICS
Characteristic
Test Conditions (Typical Value)
Unit
Note 4 Note 5 Note 6
Thermal Characteristics, SO−8 Junction−to−Lead (y
JLx
, q
JLx
)
Junction−to−Ambient (R
θ
JA
, q
JA
)
72
198
58
150.7
58.3
124.5
°C/W
Thermal Characteristics, SO−14 Junction−to−Lead (y
JLx
, q
JLx
)
Junction−to−Ambient (R
θ
JA
, q
JA
)
15.1
142.7
19.9
101.2
19.3
86.1
°C/W
Thermal Characteristics, TSSOP−14 EP Junction−to−Tab (y
JLx
, q
JLx
)
Junction−to−Ambient (R
θ
JA
, q
JA
)
9.7
111.6
11.4
78.7
11.7
53.7
°C/W
4. 2 oz Copper, 50 mm sq Copper area, 1.5 mm thick FR4.
5. 2 oz Copper, 150 mm sq Copper area, 1.5 mm thick FR4.
6. 2 oz Copper, 500 mm sq Copper area, 1.5 mm thick FR4.
