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MC74LVX245DWR2G

P1-P3P4-P6P7-P7
MC74LVX245
http://onsemi.com
4
AC ELECTRICAL CHARACTERISTICS (Input t
r
= t
f
= 3.0 ns)
Symbo
l
Parameter Test Conditions
T
A
= 25°C T
A
= −40 to 85°C
Unit
Min Typ Max Min Max
t
PLH
,
t
PHL
Propagation Delay
Input to Output
V
CC
= 2.7 V C
L
= 15 pF
C
L
= 50 pF
6.1
8.6
10.7
14.2
1.0
1.0
13.5
17.0
ns
V
CC
= 3.3 ± 0.3 V C
L
= 15 pF
C
L
= 50 pF
4.7
7.2
6.6
10.1
1.0
1.0
8.0
11.5
t
PZL
,
t
PZH
Output Enable Time to
High and Low Level
V
CC
= 2.7 V C
L
= 15 pF
R
L
= 1 kW C
L
= 50 pF
9.0
11.5
16.9
20.4
1.0
1.0
20.5
24.0
ns
V
CC
= 3.3 ± 0.3 V C
L
= 15 pF
R
L
= 1 kW C
L
= 50 pF
7.1
9.6
11.0
14.5
1.0
1.0
13.0
16.5
t
PLZ
,
t
PHZ
Output Disable Time From
High and Low Level
V
CC
= 2.7 V C
L
= 50 pF
R
L
= 1 kW
11.5 18.0 1.0 21.0
ns
V
CC
= 3.3 ± 0.3 V C
L
= 50 pF
R
L
= 1 kW
9.6 12.8 1.0 14.5
t
OSHL
t
OSLH
Output−to−Output Skew
(Note 1)
V
CC
= 2.7 V C
L
= 50 pF
V
CC
= 3.3 ± 0.3 V C
L
= 50 pF
1.5
1.5
1.5
1.5
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbo
l
Parameter
T
A
= 25°C T
A
= −40 to 85°C
Unit
Min Typ Max Min Max
C
in
Input Capacitance (T/R, OE) 4 10 10 pF
C
I/O
Maximum 3−State I/O Capacitance 8 pF
C
PD
Power Dissipation Capacitance (Note 2) 21 pF
2. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
/8 (per bit). C
PD
is used to determine the no−load
dynamic power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
NOISE CHARACTERISTICS (Input t
r
= t
f
= 3.0ns, C
L
= 50pF, V
CC
= 3.3V, Measured in SOIC Package)
Symbo
l
Characteristic
T
A
= 25°C
Unit
Typ Max
V
OLP
Quiet Output Maximum Dynamic V
OL
0.5 0.8 V
V
OLV
Quiet Output Minimum Dynamic V
OL
−0.5 −0.8 V
V
IHD
Minimum High Level Dynamic Input Voltage 2.0 V
V
ILD
Maximum Low Level Dynamic Input Voltage 0.8 V
MC74LVX245
http://onsemi.com
5
Figure 2. Figure 3.
V
CC
GND
Input
A or B
Output
B or A
50%
50% V
CC
t
PLH
t
PHL
SWITCHING WAVEFORMS
OE
A or B
A or B
50% V
CC
50% V
CC
50% V
CC
t
PZL
t
PLZ
t
PZH
t
PHZ
V
CC
GND
HIGH
IMPEDANCE
V
OL
+0.3V
V
OH
-0.3V
HIGH
IMPEDANCE
V
CC
GND
50%
T/R
50% V
CC
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL
.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH
.
1 kW
TEST CIRCUITS
Figure 4. Propagation Delay Test Circuit Figure 5. 3−State Test Circuit
ORDERING INFORMATION
Device Package Shipping
†
MC74LVX245DWR2G SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74LVX245DTR2G TSSOP−20
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74LVX245
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B 4.30 4.50 0.169 0.177
C 1.20 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
D
G
H
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V
S
T
20X REFK
L
L/2
2X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
--- ---
S
U0.15 (0.006) T
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74LVX245DWR2G

Mfr. #:
Buy MC74LVX245DWR2G
Manufacturer:
ON Semiconductor
Description:
Bus Transceivers 2-5.5V Octal Bus Transceiver
Lifecycle:
New from this manufacturer.
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