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AT24C01BN-SH-B

P1-P3P4-P6
5
AT24C01B
Note: 1. This parameter is ensured by characterization only.
Table 2-3. AC Characteristics
Applicable over recommended operating range from T
AI
= –40°C to +85°C, V
CC
= +1.8V to +5.5V, CL = 1 TTL Gate and
100 pF (unless otherwise noted)
Symbol Parameter
1.8, 2.5, 2.7 5.0-volt
UnitsMin Max Min Max
f
SCL
Clock Frequency, SCL 400 1000 kHz
t
LOW
Clock Pulse Width Low 1.2 0.4 µs
t
HIGH
Clock Pulse Width High 0.6 0.4 µs
t
I
Noise Suppression Time 50 40 ns
t
AA
Clock Low to Data Out Valid 0.1 0.9 0.05 0.55 µs
t
BUF
Time the bus must be free before a new transmission can start 1.2 0.5 µs
t
HD.STA
Start Hold Time 0.6 0.25 µs
t
SU.STA
Start Setup Time 0.6 0.25 µs
t
HD.DAT
Data In Hold Time 0 0 µs
t
SU.DAT
Data In Setup Time 100 100 ns
t
R
Inputs Rise Time
(1)
0.3 0.3 µs
t
F
Inputs Fall Time
(1)
300 100 ns
t
SU.STO
Stop Setup Time 0.6 .25 µs
t
DH
Data Out Hold Time 50 50 ns
t
WR
Write Cycle Time 5 5 ms
Endurance
(1)
5.0V, 25°C, Byte Mode 1 Million
Write
Cycles
13
AT24C01B
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT 23 and dBGA2 = 5K per reel.
3.Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Please contact Serial Interface Marketing.
AT24C01B Ordering Information
Ordering Code Package
Voltage
Range Operation Range
AT24C01B-PU (Bulk form only) 8P3 1.8V to 5.5V
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C01BN-SH-B
(1)
(NiPdAu Lead Finish) 8S11.8V to 5.5V
AT24C01BN-SH-T
(2)
(NiPdAu Lead Finish) 8S11.8V to 5.5V
AT24C01B-TH-B
(1)
(NiPdAu Lead Finish) 8A2 1.8V to 5.5V
AT24C01B-TH-T
(2)
(NiPdAu Lead Finish) 8A2 1.8V to 5.5V
AT24C01BY6-YH
-T(2)
(NiPdAu Lead Finish) 8Y6 1.8V to 5.5V
AT24C01B-TSU
-T(2)
5TS11.8V to 5.5V
AT24C01BU3-UU
-T(2)
8U3-1 1.8V to 5.5V
AT24C01B-W-11
(3)
Die Sale 1.8V to 5.5V Industrial Temperature
(–40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y6 8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Pla stic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Array Package (dBGA2)
20
AT24C01B
10.3 8A2 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20
A2 0.80 1.00 1.05
b 0.19 – 0.304
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion
and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
8A2
B
Side View
End View
Top View
A2
A
L
L1
D
123
E1
N
b
Pin 1 indicator
this corner
E
e
P1-P3P4-P6

AT24C01BN-SH-B

Mfr. #:
Buy AT24C01BN-SH-B
Manufacturer:
Microchip Technology / Atmel
Description:
EEPROM 1K 2-WIRE 128 x 8 1.8V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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