IRFI1310N

IRFI1310N
PRELIMINARY
HEXFET
®
Power MOSFET
PD - 9.1611A
S
D
G
V
DSS
= 100V
R
DS(on)
= 0.036
I
D
= 24A
l Advanced Process Technology
l Isolated Package
l High Voltage Isolation = 2.5KVRMS
l Sink to Lead Creepage Dist. = 4.8mm
l Fully Avalanche Rated
TO-220 FULLPAK
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 2.7
R
θJA
Junction-to-Ambient ––– 65
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial
applications. The moulding compound used provides
a high isolation capability and a low thermal resistance
between the tab and external heatsink. This isolation
is equivalent to using a 100 micron mica barrier with
standard TO-220 product. The Fullpak is mounted to
a heatsink using a single clip or by a single screw
fixing.
3/16/98
Description
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 24
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 17 A
I
DM
Pulsed Drain Current  140
P
D
@T
C
= 25°C Power Dissipation 56 W
Linear Derating Factor 0.37 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 420 mJ
I
AR
Avalanche Current 22 A
E
AR
Repetitive Avalanche Energy 5.6 mJ
d
v
/d
t
Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 screw 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
°C/W
IRFI1310N
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 100 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.11 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.036 V
GS
= 10V, I
D
= 13A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 14 ––– ––– S V
DS
= 25V, I
D
= 22A
––– ––– 25
µA
V
DS
= 100V, V
GS
= 0V
––– ––– 250 V
DS
= 80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -20V
Q
g
Total Gate Charge ––– ––– 120 I
D
= 22A
Q
gs
Gate-to-Source Charge ––– ––– 15 nC V
DS
= 80V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 58 V
GS
= 10V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time ––– 11 ––– V
DD
= 50V
t
r
Rise Time ––– 56 ––– I
D
= 22A
t
d(off)
Turn-Off Delay Time ––– 45 ––– R
G
= 3.6
t
f
Fall Time ––– 40 ––– R
D
= 2.9Ω, See Fig. 10 
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 1900 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 450 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 230 ––– ƒ = 1.0MHz, See Fig. 5
C Drain to Sink Capacitance ––– 12 ––– ƒ = 1.0MHz
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
pF
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Starting T
J
= 25°C, L = 1.0mH
R
G
= 25, I
AS
= 22A. (See Figure 12)
t=60s, ƒ=60Hz
I
SD
22A, di/dt 180A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Uses IRF1310N data and test conditions
Pulse width 300µs; duty cycle 2%.
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) 
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 13A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 180 270 ns T
J
= 25°C, I
F
= 22A
Q
rr
Reverse RecoveryCharge ––– 1.2 1.8 µC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
A
24
140
IRFI1310N
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
1000
0.1 1 10 100
20us PULSE WIDTH
T = 25 C
J
o
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
1000
0.1 1 10 100
20us PULSE WIDTH
T = 175 C
J
o
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
1000
4.0 5.0 6.0 7.0 8.0 9.0 10.0
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
o
T = 175 C
J
o
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
o
V =
I =
GS
D
10V
36A

IRFI1310N

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 100V 24A TO220FP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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