DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .157 .181 4.00 4.60
B .098 .114 2.50 2.90
C .006 .012 0.152 0.305
D..030 .060 0.76 1..52
E .188 .208 4.80 5.28
F .078 .096 2.00 2.44
G .050 .064 1.27 1.63
H .002 .008 0.051 0.203
Features
• For Surface Mount Applications
• Unidirectional And Bidirectional
• High Surge Capability
• High Temp Soldering: 2
60°C for 10 Seconds At Terminals
• For Bidirectional Devices Add “C” To The Suffix of The Part
Number: i.e.SMA6J9.0CA for 5% Tolerance
0D[LPXP5DWLQJ
• Operating Temperature: -55°C to +175°C
• Storage Temperature: -55°C to +175°C
•
Typical Thermal Resistance: 33 /W Junction to lead
Peak Pulse Current on
10/1000us Waveform
I
PPM
See Table 1 Note 2
Peak Pulse Power Dissipation P
PPM
Min 600 W Note 2, 6
Steady State Power Dissipation P
M(AV)
3.0 W Note 5
2. Non-repetitive current pulse, per Fig.4 and derated above
T
A
=25
o
C per Fig1
3. Mounted on 5.0mm
2
copper pads to each terminal.
4. 8.3ms, single half sine wave duty cycle = 4 pulses per
Minutes maximum.
5. Lead temperature at T
L
= 75
o
C.
6. Peak pulse power waveform is 10/1000us
A
E
F
G
H
DO-214AC
(SMA)( LEAD FRAME)
omponents
20736 Marilla Street Chatsworth
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Revision: I
2016/08/18
0HFKDQLFDO'DWD
• Polarity: Indicated by cathode band except bi-directional types
www.mccsemi.com
1 of 4
• Lead Free Finish/Rohs Compliant (Note1)
("P"Suffix designates
Compliant. See ordering information)
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
• Epoxy meets UL 94 V-0 flammability rating
• Moisure Sensitivity Level 1
•
H
alogen free available upon request by adding suffix "-HF"
