ADPD2214 Data Sheet
Rev. 0 | Page 4 of 13
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage (VCC) 6.0 V
Storage Temperature Range
Junction Temperature 110°C
Solder Reflow Temperature (<10 sec) 260°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
4 mm × 4 mm LFCSP 52.45 11.55 °C/W
SOLDERING PROFILE
Figure 2 and Table 4 provide information about the recommended
soldering profile.
Figure 2. Recommended Soldering Profile
Table 4. Recommended Soldering Profile Limits
1
Profile Feature Condition (Pb Free)
Average Ramp Rate (T
L
to T
P
) 2°C/sec maximum
Preheat
SMIN
Maximum Temperature (T
SMAX
) 200°C
Time from T
SMIN
to T
SMAX
(t
S
) 60 sec to 120 sec
Ramp-Up Rate (T
SMAX
to T
L
) 2°C/sec maximum
Liquidus Temperature (T
L
) 217°C
Time Maintained Above T
L
(t
L
) 60 sec to 150 sec
P
Time Within 5°C of Actual T
P
(t
P
) 20 sec to 30 sec
Ramp-Down Rate 3°C/sec maximum
Time from 25°C (t25°C) to Peak
Temperature
8 minutes maximum
1
Based on JEDEC Standard J-STD-020D.1.
ESD CAUTION
t
P
t
L
t
25°C TO PEAK
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
T
SMIN
T
SMAX
T
P
T
L
13720-022
