CAT34C02
www.onsemi.com
10
Ordering Information
Device Order Number
Specific
Device
Marking
Package Type Temperature Range
Lead
Finish
Shipping
CAT34C02HU4EGT4A D1U UDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02HU4I−GT4 D1U UDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02HU4I−GTK D1U UDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02HU4IGT4A D1U UDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02VP2I−GT4 D1T TDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02VP2IGT4A D1T TDFN−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
4,000 Units / Reel
CAT34C02YI−GT5 34CH TSSOP−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
5,000 Units / Reel
CAT34C02YI−GT5A 34CH TSSOP−8 I = Industrial
(−40°C to +85°C)
NiPdAu Tape & Reel,
5,000 Units / Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
14.All packages are RoHS−compliant (Lead−free, Halogen−free)
15.The standard lead finish is NiPdAu.
16.For Gresham ONLY die, please order the OPNs: CAT34C02YI−GT5A, CAT34C02VP2IGT4A, CAT34C02HU3IGT4A
or CAT34C02HU4IGT4A.
17.For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
ON Semiconductor is licensed by the Philips Corporation to carry the I
2
C bus protocol.
TDFN8, 2x3, 0.5P
CASE 511AK
ISSUE B
DATE 18 MAR 201
5
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
REFERENCE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
L
D2
E2
C
C0.10
C0.08
A1
SEATING
PLANE
NOTE 3
b
8X
0.10 C
0.05 C
A
B
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
b 0.20 0.30
D 2.00 BSC
D2 1.30 1.50
E 3.00 BSC
E2 1.20 1.40
e 0.50 BSC
L 0.20 0.40
1
4
8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
PITCH
1.45
3.40
1
DIMENSIONS: MILLIMETERS
1
NOTE 4
0.30
8X
DETAIL A
A3 0.20 REF
A3
A
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
L1 −− 0.15
e
RECOMMENDED
5
1.56
GENERIC
MARKING DIAGRAM*
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
XXXXX
AWLYWG
1
M
M
0.68
C0.10
8X
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
REFERENCE:
DESCRIPTION:
98AON34336E
ON SEMICONDUCTOR STANDARD
TDFN8, 2X3, 0.5P
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON34336E
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION FROM POD #TDFN8−008−01 TO ON SEMICON-
DUCTOR. REQ. BY B. BERGMAN.
19 DEC 2008
A CHANGED DESCRIPTION FROM WDFN TO TDFN. 18 MAR 2009
B REDREW PACKAGE DRAWING TO ON SEMICONDUCTOR/JEDEC STANDARD.
REQ. BY B. BECKER.
18 MAR 2015
© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. B
Case Outline Number
:
511AK
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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CAT34C02YI-G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
EEPROM (256x8) 2K 1.7-5.5
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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