4
Absolute Maximum Ratings
Storage Temperature, T
S
–55˚C to +150˚C
Operating Temperature, T
A
–55˚C to +100˚C
Lead Solder Temperature, max.
(1.6 mm below seating plane)
260˚C for 10 s
Average Forward Current, I
F
80 mA
Reverse Input Voltage, V
R
6 V
Input Power Dissipation, P
I
150 mW
Collector Current, I
C
100 mA
Collector-Emitter Voltage, V
CEO
30 V
Emitter-Collector Voltage, V
ECO
7 V
Collector-Base Voltage, V
CBO
70 V
Collector Power Dissipation 150 mW
Total Power Dissipation 250 mW
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
2500 Vrms
Solder Reow Temperature Prole
1. One-time soldering reow is recommended with-
in the condition of temperature and time prole
shown at right.
2. When using another soldering method such as in-
frared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non-halide ux should be used.
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25C
150C
200C
250C
260C (Peak Temperature)
217C
Time (sec)
Temperature (C)
* CTR = x 100%
I
C
I
F
Electrical Specications (T
A
= 25˚C)
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage V
F
– 1.2 1.5 V I
F
= 10 mA
Reverse Current I
R
– – 10 µA V
R
= 4 V
Terminal Capacitance C
t
– 50 – pF V = 0, f = 1 KHz
Collector Dark Current I
CEO
– – 50 nA V
CE
= 10 V, I
F
= 0
Collector-Emitter Breakdown Voltage BV
CEO
30 – – V I
C
= 0.1 mA, I
F
= 0
Emitter-Collector Breakdown Voltage BV
ECO
7 – – V I
E
= 10 µA, I
F
= 0
Collector-Base Breakdown Voltage BV
CBO
70 – – V I
C
= 0.1 mA, I
F
= 0
Collector Current I
C
2 – – mA I
F
= 10 mA
*Current Transfer Ratio CTR 20 – – % V
CE
= 10 V
Collector-Emitter Saturation Voltage V
CE(sat)
– 0.1 0.5 V I
F
= 50 mA, I
C
= 2 mA
Response Time (Rise) t
r
– 3 – µs V
CE
= 10 V, I
C
= 2 mA
Response Time (Fall) t
f
– 3 – µs R
L
= 100 Ω
Isolation Resistance R
iso
5 x 10
10
1 x 10
11
– Ω DC 500 V 40 ~ 60%
R.H.
Floating Capacitance C
f
– 1 – pF V = 0, f = 1 MHz