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AT24C128-10PU-2.7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
13
AT24C128/256
0670T–SEEPR–3/07
Notes: 1. This device is not recommended for new design. Please refer to AT24C128B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
AT24C128 Ordering Information
(1)
Ordering Code Package Operation Range
AT24C128-10PU-2.7
(2)
AT24C128-10PU-1.8
(2)
AT24C128N-10SU-2.7
(2)
AT24C128N-10SU-1.8
(2)
AT24C128W-10SU-2.7
(2)
AT24C128W-10SU-1.8
(2)
AT24C128-10TU-2.7
(2)
AT24C128-10TU-1.8
(2)
AT24C128U2-10UU-1.8
(2)
AT24C128Y1-10YU-1.8
(2)
AT24C128Y4-10YU-1.8
(2)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Lead-free/Halogen-free/
Industrial Temperature
(–40° C to 85° C)
AT24C128-W1.8-11
(3)
Die Sale Industrial Temperature
(–40° C to 85° C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y4 8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 3.6V)
14
AT24C128/256
0670T–SEEPR–3/07
Notes: 1. This device is not recommended for new design. Please refer to AT24C256B datasheet. For 2.7V devices used in the 4.5V to
5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green Package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
AT24C256 Ordering Information
(1)
Ordering Code Package Operation Range
AT24C256-10PU-2.7
(2)
AT24C256-10PU-1.8
(2)
AT24C256N-10SU-2.7
(2)
AT24C256N-10SU-1.8
(2)
AT24C256W-10SU-2.7
(2)
AT24C256W-10SU-1.8
(2)
AT24C256-10TU-2.7
(2)
AT24C256-10TU-1.8
(2)
AT24C256U2-10UU-1.8
(2)
AT24C256Y1-10YU-1.8
(2)
AT24C256Y4-10YU-1.8
(2)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y1
8Y4
Lead-free/Halogen-free/
Industrial Temperature
(–40° C to 85° C)
AT24C256-W1.8-11
(3)
Die Sale Industrial Temperature
(–40° C to 85° C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y4 8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 3.6V)
15
AT24C128/256
0670T–SEEPR–3/07
Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23

AT24C128-10PU-2.7

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Buy AT24C128-10PU-2.7
Manufacturer:
Description:
IC EEPROM 128K I2C 1MHZ 8DIP
Lifecycle:
New from this manufacturer.
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