MC74ACT05MELG

MC74AC05, MC74ACT05
www.onsemi.com
4
DC CHARACTERISTICS
Symbol Parameter
V
CC
(V)
74ACT 74ACT
Unit Conditions
T
A
= +25°C T
A
= −40°C to +85°C
Typ Guaranteed Limits
V
IH
Minimum High Level Input Voltage 4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
V
OUT
= 0.1 V
or V
CC
− 0.1 V
V
IL
Maximum Low Level Input Voltage 4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
V
OUT
= 0.1 V
or V
CC
− 0.1 V
V
OL
Maximum Low Level Output Voltage 4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
V
I
OUT
= 50 mA
4.5
5.5
0.36
0.36
0.44
0.44
0.44 *V
IN
= V
IL
or V
IH
I
OH
24 mA
I
IN
Maximum Input Leakage Current 5.5 ±0.1 ±1.0
mA
V
I
= V
CC
, GND
DI
CCT
Additional Max. I
CC
/Input 5.5 0.6 1.5 mA V
I
= V
CC
− 2.1 V
I
OLD
I
OHD
†Minimum Dynamic Output Current
5.5
5.5
75
−75
mA
mA
V
OLD
= 1.65 V Max
V
OHD
= 3.85 V Min
I
CC
Maximum Quiescent Supply Current 5.5 4.0 40
mA
V
IN
= V
CC
or GND
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*All outputs loaded; thresholds on input associated with output under test.
Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS
Symbol Parameter
V
CC
*
(V)
74ACT 74ACT
Unit
T
A
= +25°C C
L
= 50 pF T
A
= −40°C to +85°C C
L
= 50 pF
Min Typ Max Min Max
t
PZL
Propagation Delay Output Enable 5.0 1.5 8.0 1.0 8.5 ns
t
PLZ
Propagation Delay Output Enable 5.0 1.5 8.5 1.0 9.0 ns
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value Typ Unit Test Conditions
C
IN
Input Capacitance 4.5 pF V
CC
= 5.0 V
C
PD
Power Dissipation Capacitance 30 pF V
CC
= 5.0 V
ORDERING INFORMATION
Device Package Shipping
MC74AC05DG SOIC−14
(Pb−Free)
55 Units / Rail
MC74AC05DR2G SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74ACT05DG SOIC−14
(Pb−Free)
55 Units / Rail
MC74ACT05DR2G SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74ACT05DTR2G TSSOP−14
(Pb−Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74AC05, MC74ACT05
www.onsemi.com
5
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC05, MC74ACT05
www.onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74ACT05MELG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Inverters 5V CMOS Hex w/Open Drain
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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