CM1223
http://onsemi.com
10
PACKAGE DIMENSIONS
SOT−143
CASE 318A−06
ISSUE U
DIM
D
MIN MAX
2.80 3.05
MILLIMETERS
E1 1.20 1.40
A 0.80 1.12
b 0.30 0.51
b1 0.76 0.94
e 1.92 BSC
L 0.35 0.70
c 0.08 0.20
L2 0.25 BSC
e1 0.20 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM
UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE.
5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
A-B
M
0.20 DC
A
0.10 C
SIDE VIEW
SEATING
PLANE
SOLDERING FOOTPRINT*
0.75
4X
DIMENSIONS: MILLIMETERS
0.54
1.92
3X
RECOMMENDED
A1 0.01 0.15
D
B
TOP VIEW
D
3X
b
E
b1
E1
e
e1
A
A1
C
c
END VIEW
H
c
SEATING
PLANE
L2
L
GAUGE
PLANE
DETAIL A
DETAIL A
2.70
0.20
0.96
E 2.10 2.64
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
