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903-23-2-18-2-B-0

P1-P3
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to
devices from:
Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex,
Infineon, Microsemi, and many more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many more
Industries.
Material: AL 6063
Finish: Black Anodize
PIN FIN HEAT SINK
903 Series
PART #
HEIGHT
(mm)
CHIP
SIZE
(mm)
NATURAL CONVECTION
FORCED CONVECTION
(C/W)
200 LFM
400 LFM
600 LFM
903-23-2-12-2-B-0
12
23
12.06 C/W
5.72 C/W
3.95 C/W
3.24 C/W
903-23-2-15-2-B-0
15
23
11.41 C/W
5.39 C/W
3.67 C/W
2.99 C/W
903-23-2-18-2-B-0
18
23
10.76 C/W
5.05 C/W
3.35 C/W
2.67 C/W
903-23-2-21-2-B-0
21
23
10.11 C/W
4.74 C/W
3.1 C/W
2.46 C/W
903-23-2-23-2-B-0
23
23
9.99 C/W
4.44 C/W
2.87 C/W
2.31 C/W
903-23-2-28-2-B-0
28
23
9.70 C/W
4.09 C/W
2.62 C/W
2.12 C/W
903-23-2-33-2-B-0
33
23
9.41 C/W
3.83 C/W
2.43 C/W
1.96 C/W
6
903-23-2-12-2-B-0
THERMAL PERFORMANCE:
T h e r m a l C o o l i n g S o l u t i o n s f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
1
2
3
4
5
200 LFM
400 LFM
600 LFM
C/Watt
903-23-2-12-2-B-0
903-23-2-15-2-B-0
903-23-2-18-2-B-0
903-23-2-21-2-B-0
903-23-2-23-2-B-0
903-23-2-28-2-B-0
903-23-2-33-2-B-0
Series
Chip Size
Construction
Height
Chip Height
Finish
Interface
903-
19-
2-
12-
1-
B-
1
19
2= Pin Fin
12 = 11.6
1 = .9-2.1
B = BLK
ANO
0 = None
21
15 = 14.6
2 = 2.2-3.4
1 = T725
23
18 = 17.6
27
21 = 20.6
29
23 = 22.6
31
28 = 27.6
33
33 = 32.6
35
37.5
40
PIN FIN HEAT SINK
903 Series
ASSEMBLY INSTRUCTION:
Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and
the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.
Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage
chip. Contact area is the edge of chip.
T h e r m a l C o o l i n g S o l u t i o n s f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
Random Vibration Test
Frequency ：5 Hz to 500 Hz
Acceleration ：3.13 grms
P.S.D ：0.01 g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis ：X, Y, Z axis
Test Time ：10 mins (Each axis)
Total Test Time ：30 mins
SHOCK TEST SPECIFICATION：
Wave Form ：Half sine wave
Acceleration ：50 g
Duration Time ：11 ms
No. of Shock ：Each axis 3 times
Shock Direction ：±X, ±Y, ±Z axis
Reliability & Communication
Testing Instruments
Step 1: Hook the
clip under one
side of the BGA
chip set.
Step 2: Rotate
assembly down
until opposite
side clip engages
substrate edge of
BGA chip set.
Step 3: Make sure
the sop rods are
clearing from edges
of BGA chip set.
Step 4: Press firmly
down to make sure
clips fully engage
edges of chip set.
Heat Sink should not
move around easily.
P1-P3

903-23-2-18-2-B-0

Mfr. #:
Buy 903-23-2-18-2-B-0
Manufacturer:
Wakefield-Vette
Description:
Heat Sinks Chipset Heatsink with Clip, Pin Fin, 23mm Chip Size, 17.6mm Height, Aluminum, Black Anodized
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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