Data Sheet ADG801/ADG802
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Analog Inputs
1
−0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
−0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Continuous Current, Pin S or Pin D 400 mA
Peak Current, Pin S or Pin D
800 mA, pulsed at 1 ms,
10% duty cycle max
Operating Temperature Range
Automotive
−40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (T
JMAX
) 150°C
Package Power Dissipation (T
JMAX
– T
A
)/θ
JA
MSOP
θ
JA
Thermal Impedance 206°C/W
θ
JC
Thermal Impedance 44°C/W
SOT-23 (4-Layer Board)
θ
JA
Thermal Impedance 119°C/W
θ
JC
Thermal Impedance 91.99°C/W
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
235°C
Reflow Soldering (Pb-Free)
Peak Temperature 260(+0/−5)°C
Time at Peak Temperature 10 sec to 40 sec
1
Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes.
Current should be limited to the maximum ratings provided.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Truth Table
ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition
0 1 Off
1 0 On
ESD CAUTION
