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L6743B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
L6743B Package mechanical data
13/16
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Package mechanical data L6743B
14/16
Figure 9. VFDFPN8 mechanical data and package dimensions
DIMENSIONS
REF.
mm mils
MIN. TYP. MAX. MIN. TYP. MAX.
A 0.80 0.90 1.00 31.49 35.43 39.37
A1 0.02 0.05 0.787 1.968
A2
0.65
25.59
A3 0.20 7.874
b 0.18 0.25 0.30 7.086 9.842 11.81
D
3.00
118.1
D2 2.20 2.70 86.61 106.3
E
3.00
E2 1.40 1.75 55.11 68.89
e0.50
L 0.30 0.40 0.50 11.81 15.74 19.68
PACKAGE AND
PACKING INFORMATION
VFDFPN8 (3x3)
Weight: not available
Very thin Fine pitch Dual
Flat Package no Lead
0.55 0.80
2.85 3.15
2.85 3.15
ddd 0.08 3.149
21.65 31.49
112.2 124.0
118.1112.2 124.0
19.68
L6743B Revision history
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7 Revision history
Table 5. Document revision history
Date Revision Changes
17-Jun-2008 1 Initial release
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

L6743B

Mfr. #:
Buy L6743B
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Hi-current MOSFET Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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