SML-D15YWT86

    
[Data Sheet]
Stress strength according to
he mounting position:
A>B>C>D
so please pay attention to the touch on product.
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
 and rear electrodes but not for formation of solder fillet.
4-3. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack
or damage of LED internal junction, therefore, please concern the mounting direction and position
to avoid bending or screwing with great stress of the circuit board.
4―4. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting,
to prevent electrostatic charge.
expansion and moisture absorption at humidity will cause heat stress during soldering process and
the mounter to control the product stabilization. In addition, it is recommended to set ionizer
・For our product that has no solder resist, because of its solder amount and soldering conditions,
that will influence its reliability.Therefore, please be informed, concerning it before using it.
In case of carrying out flow soldering of surrounding parts without recommended conditions, please
contact us for inquiries.
4-5.Soldering Pattern for Recommendation
finally has bad influence on the product’s reliability.
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin
4-2. Automatic Mounting
4-2-1. Silicon Resin Sealing Product
The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress
directly on the sealing section.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering
with other parts within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions,
it may cause the discoloration of the resin.
 one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility
・The product is not guaranteed for flow soldering.
・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature
shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
[SML-D15x series]
4.Mounting
4-1. Soldering
4-2-2. Mini Package (Smaller than 1608 size)
・Vibration may result in low mounting rate since it will cause the static electricity of product and
adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of
0.8mm
0.85mm
0.8mm
0.8mm
PCB Bonding Direction
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7/8
2017.4 - Rev.003
    
[Data Sheet]
Ultrasonic Cleaning
15W/Below 1 liter (capacity of tank)
Drying
Under 100℃ within 3 minutes
furnaces vary by customer’s own conditions.
So thermal stress by soldering greatly influence its reliability.
Please keep following points for manual soldering.
ITEM
a) Heating method
b)
Handling after
soldering
Please handle after the part temp.
goes down to room temp.
Temperature
Under 30℃ within 3 minutes
Solvent
We recommend to use alcohols solvent such as, isopropyl alcohols
4-8.Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
LED. (Fig-1)
Sn-Cu,Sn-Ag-Cu,Sn-Ag-Bi-Cu
②HAND SOLDERING CONDITION
Over 60sec.
230〜260℃
Meanings
Maximum of pre-heating temperature
Minimum of pre-heating temperature
ΔT
D
/Δt
Temperature decreasing rate
Retention time for TL
Over -3℃/sec.
t
L
T
P
t
P
ΔT
R
/Δt
4-6.Reflow Profile
For reflow profile, please refer to the conditions below:(※)
■Meaning of marks, Conditions
Mark
Conditions
[SML-D15x series]
LED products do not contain reinforcement material such as a glass fillers.
Peak temperature
Time for peak temperature
Temperature rising rate
Within 40sec.
260℃(Max)
Within 10sec.
Under 3℃/sec.
Time from Tsmin to Tsmax
Reference temperature
Ts
max
Ts
min
t
s
T
L
180℃
140℃
4-7.Attention Points in Soldering Operation
This product was developed as a surface mount LED especially suitable for reflow soldering.
So reflow soldering is recommended. In case of implementing manual soldering,
please take care of following points.
①SOLDER USED
RECOMMENDED CONDITION
Condition ) Temp. of iron top less than
400℃ within 3 sec.
Heating on PCB pattern, not direct to the
※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and
reflow furnaces before using, because stress from circuit boards and temperature variations of reflow
Fig-1
SOLDERING
LAND
SOLDERING IRON
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A
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ROHM Co., Ltd. All rights reserved.
Notice
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
Notes
The information contained herein is subject to change without notice.
Before you use our Products, please contact our sales representative
and verify the latest specifica-
tions :
Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
The Products specified in this document are not designed to be radiation tolerant.
For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
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SML-D15YWT86

Mfr. #:
Manufacturer:
ROHM Semiconductor
Description:
Standard LEDs - SMD SNGL Rank Mini-mold LED Yellowish Green
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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