Outline Dimensions
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Vishay Semiconductors
Revision: 03-Aug-17
1
Document Number: 96154
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3L TO-220AB
DIMENSIONS in millimeters and inches
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension and finish uncontrolled in L1
(3)
Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4)
Dimension b1, b3, and c1 apply to base metal only
(5)
Controlling dimensions: inches
(6)
Thermal pad contour optional within dimensions E, H1, D2, and E1
(7)
Outline conforms to JEDEC
®
TO-220, except D2 (minimum)
SYMBOL
MILLIMETERS INCHES
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.25 4.65 0.167 0.183 D2 11.68 12.88 0.460 0.507 6
A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6
A2 2.50 2.92 0.098 0.115 E1 6.86 8.89 0.270 0.350 6
b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105
b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208
b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6, 7
b3 1.14 1.73 0.045 0.068 4 L 13.52 14.02 0.532 0.552
c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2
c1 0.36 0.56 0.014 0.022 4 Ø P 3.54 3.91 0.139 0.154
D 14.85 15.35 0.585 0.604 3 Q 2.60 3.00 0.102 0.118
D1 8.38 9.02 0.330 0.355
13
2
C
C
D
D
3 x b23 x b
(b, b2)
b1, b3
Lead tip
0.014 AB
M M
0.015 AB
M M
Conforms to JEDEC
®
outline TO-220AB
(6)
(6)
(6)
(7)
L1
(2)
Detail B
Section C - C and D - D
Base metal Plating
(4)
(4)
c1
c
(6)
(6)
Ø P
E
Q
D
L
c
D1
e
e1
2 x
A
B
A
A
A
C
A2
A1
Thermal pad
H1
(E)
(H1)
D2
Detail B
E1
View A - A
