I
DD
Specifications
Table 13: DDR4 I
DD
Specifications and Conditions – 4GB (Die Revision B)
Values are for the MT40A512M16 DDR4 SDRAM only and are computed from values specified in the 8Gb (512 Meg x 16)
component data sheet
Parameter Symbol 2666 2400 Units
One bank ACTIVATE-PRECHARGE current I
DD0
340 320 mA
One bank ACTIVATE-PRECHARGE, Word Line Boost, I
PP
current I
PP0
16 16 mA
One bank ACTIVATE-READ-PRECHARGE current I
DD1
420 400 mA
Precharge standby current I
DD2N
140 136 mA
Precharge standby ODT current I
DD2NT
300 300 mA
Precharge power-down current I
DD2P
100 100 mA
Precharge quiet standby current I
DD2Q
120 120 mA
Active standby current I
DD3N
200 188 mA
Active standby I
PP
current I
PP3N
12 12 mA
Active power-down current I
DD3P
172 164 mA
Burst read current I
DD4R
1052 972 mA
Burst write current I
DD4W
976 912 mA
Burst refresh current (1x REF) I
DD5B
1120 1120 mA
Burst refresh I
PP
current (1x REF) I
PP5B
112 112 mA
Self refresh current: Normal temperature range (0°C to 85°C) I
DD6N
120 120 mA
Self refresh current: Extended temperature range (0°C to 95°C) I
DD6E
140 140 mA
Self refresh current: Reduced temperature range (0°C to 45°C) I
DD6R
80 80 mA
Auto self refresh current (25°C) I
DD6A
34.4 34.4 mA
Auto self refresh current (45°C) I
DD6A
80 80 mA
Auto self refresh current (75°C) I
DD6A
120 120 mA
Bank interleave read current I
DD7
1036 996 mA
Bank interleave read I
PP
current I
PP7
60 60 mA
Maximum power-down current I
DD8
100 100 mA
4GB (x64, SR) 288-Pin DDR4 UDIMM
I
DD
Specifications
X26P4QTWDSPK-13-10266
atf4c512x64az.pdf – Rev. B 8/16 EN
16
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
Table 14: DDR4 I
DD
Specifications and Conditions – 4GB (Die Revision D)
Values are for the MT40A512M16 DDR4 SDRAM only and are computed from values specified in the 8Gb (512 Meg x 16)
component data sheet
Parameter Symbol 2666 2400 Units
One bank ACTIVATE-PRECHARGE current I
DD0
340 320 mA
One bank ACTIVATE-PRECHARGE, Word Line Boost, I
PP
current I
PP0
16 16 mA
One bank ACTIVATE-READ-PRECHARGE current I
DD1
420 400 mA
Precharge standby current I
DD2N
140 136 mA
Precharge standby ODT current I
DD2NT
300 300 mA
Precharge power-down current I
DD2P
100 100 mA
Precharge quiet standby current I
DD2Q
120 120 mA
Active standby current I
DD3N
220 208 mA
Active standby I
PP
current I
PP3N
12 12 mA
Active power-down current I
DD3P
172 164 mA
Burst read current I
DD4R
1052 972 mA
Burst write current I
DD4W
996 932 mA
Burst refresh current (1x REF) I
DD5B
1152 1152 mA
Burst refresh I
PP
current (1x REF) I
PP5B
112 112 mA
Self refresh current: Normal temperature range (0°C to 85°C) I
DD6N
124 124 mA
Self refresh current: Extended temperature range (0°C to 95°C) I
DD6E
144 144 mA
Self refresh current: Reduced temperature range (0°C to 45°C) I
DD6R
84 84 mA
Auto self refresh current (25°C) I
DD6A
34.4 34.4 mA
Auto self refresh current (45°C) I
DD6A
84 84 mA
Auto self refresh current (75°C) I
DD6A
124 124 mA
Bank interleave read current I
DD7
1036 996 mA
Bank interleave read I
PP
current I
PP7
80 80 mA
Maximum power-down current I
DD8
100 100 mA
4GB (x64, SR) 288-Pin DDR4 UDIMM
I
DD
Specifications
X26P4QTWDSPK-13-10266
atf4c512x64az.pdf – Rev. B 8/16 EN
17
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.
SPD EEPROM Operating Conditions
For the latest SPD data, refer to Micron's SPD page: micron.com/spd.
Table 15: SPD EEPROM DC Operating Conditions
Parameter/Condition Symbol Min Nom Max Units
Supply voltage V
DDSPD
2.5 V
Input low voltage: logic 0; all inputs V
IL
–0.5 V
DDSPD
×
0.3
V
Input high voltage: logic 1; all inputs V
IH
V
DDSPD
×
0.7
V
DDSPD
+
0.5
V
Output low voltage: 3mA sink current V
DDSPD
> 2V V
OL
0.4 V
Input leakage current: (SCL, SDA) V
IN
= V
DDSPD
or V
SSSPD
I
LI
±5 µA
Output leakage current: V
OUT
= V
DDSPD
or V
SSSPD
, SDA in High-Z I
LO
±5 µA
Notes:
1. Table is provided as a general reference. Consult JEDEC JC-42.4 EE1004 and TSE2004 de-
vice specifications for complete details.
2. All voltages referenced to V
DDSPD
.
Table 16: SPD EEPROM AC Operating Conditions
Parameter/Condition Symbol Min Max Units
Clock frequency
t
SCL 10 1000 kHz
Clock pulse width HIGH time
t
HIGH 260 ns
Clock pulse width LOW time
t
LOW 500 ns
Detect clock LOW timeout
t
TIMEOUT 25 35 ms
SDA rise time
t
R 120 ns
SDA fall time
t
F 120 ns
Data-in setup time
t
SU:DAT 50 ns
Data-in hold time
t
HD:DI 0 ns
Data out hold time
t
HD:DAT 0 350 ns
Start condition setup time
t
SU:STA 260 ns
Start condition hold time
t
HD:STA 260 ns
Stop condition setup time
t
SU:STO 260 ns
Time the bus must be free before a new transi-
tion can start
t
BUF 500 ns
Write time
t
W 5 ms
Warm power cycle time off
t
POFF 1 ms
Time from power on to first command
t
INIT 10 ms
Note:
1. Table is provided as a general reference. Consult JEDEC JC-42.4 EE1004 and TSE2004 de-
vice specifications for complete details.
4GB (x64, SR) 288-Pin DDR4 UDIMM
SPD EEPROM Operating Conditions
X26P4QTWDSPK-13-10266
atf4c512x64az.pdf – Rev. B 8/16 EN
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2016 Micron Technology, Inc. All rights reserved.

MTA4ATF51264AZ-3G2E1

Mfr. #:
Manufacturer:
Micron
Description:
Memory Modules DDR4 4GB UDIMM
Lifecycle:
New from this manufacturer.
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