RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature 260 ˚C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220 ˚C 60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is
recommended).
(2) Wave soldering
• Temperature 260 ˚C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is recommended).
(3) Cautions
• Fluxes Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature ad high humidity.
Recommended Temperature Profile of Infrared Reflow
PS2911-1
Time (s)
Package Surface Temperature T (˚C)
180 ˚C
120±30 s
(preheating)
(heating)
to 10 s
to 60 s
260 ˚C (peak temperature)
220 ˚C
120˚C
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Com
ound Semiconductor Devices, Ltd
10/14/2003
