MP86885 – INTELLI-PHASE SOLUTION IN 4x6mm TQFN
MP86885 Rev. 1.01 www.MonolithicPower.com 2
7/22/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking
MP86885GQWT FC-TQFN-29 4x6(mm) M86885
* For Tape & Reel, add suffix –Z (e.g. MP86885GQWT–Z).
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage V
IN
....................................... 16V
V
SW (DC)
..............................................-1 V to 16V
V
SW (25ns)
..............................................-3V to 23V
V
BST
...................................................... V
SW
+ 6V
All Other Pins..................................-0.3V to +6V
Instantaneous Current ................................ 65A
Continuous Power Dissipation (T
A
=+25°C)
(2)
............................................................ 3.5 W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
...........................4.5V to 14V
Driver Voltage V
DRV
.........................4.5V to 5.5V
Logic Voltage V
DD
...........................4.5V to 5.5V
Operating Junction Temp. (T
J
). -40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
4x6mm FC-TQFN ................... 36 ....... 8.... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/θ
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.