BLM18GG471SN1D Datasheet BLM18GG471SN1D | P1-P3

Spec.No.JENF243A-0022H-01 P1/7

MURATA MFG.CO.,LTD.

Reference

Only

GHz Noise Suppression Chip Ferrite Bead

BLM18GG471SN1□ Reference Specification

1. Scope

This reference specification applies to Chip Ferrite Bead BLM18G_SN series.

2. Part Numbering

(ex.) BL

M 18 GG 471 S N 1 D

(1) (2) (3) (4) (5) (6) (7) (8) (9)

(1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz

(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)

3. Rating

Customer

Part Number

MURATA

Part Number

Impedance (



)

(Under Standard Testing Condition)

Rated

Current

(mA)

DC Resistance

()

Remark

at 100MHz at 1GHz

Initial

Values

After

Testing

BLM18GG471SN1D

470±25% 1800±30% 200

1.0±0.3

1.4max.

For

general

use

BLM18GG471SN1B



 Operating Temperature : -55°C to +125°C  Storage Temperature : -55°C to +125°C

4. Style and Dimensions

■ Equivalent Circuit

■ Unit Mass (Typical value)

(in mm) 0.004g

5. Marking

No marking.

6. Standard Testing Conditions

 Unless otherwise specified   In case of doubt 

Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C

Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)

Atmospheric pressure : 86kPa to 106kPa

7. Specifications

7-1. Electrical Performance

No. Item Specification Test Method

7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz

Measuring Equipment : Agilent 4291A or the equivalent

Test Fixture : Agilent 16192A or the equivalent

7-1-2 DC

Resistance

Meet item 3. Measuring Equipment : Digital multi meter

:Electrode

1.6±0.1

0.8±0.1

0.35±0.15

0.8±0.1

Resistance element becomes

dominant at high frequencies.

()

Spec.No.JENF243A-0022H-01 P2/7

MURATA MFG.CO.,LTD.

Reference

Only

7-2. Mechanical Performance

No. Item Specification Test Method

7-2-1 Appearance

and

Dimensions

Meet item 4. Visual Inspection and measured with Silde Calipers.

7-2-2 Bonding

Strength

Meet Table 1.

Table 1

It shall be soldered on the substrate.

Applying Force(F) : 10N

Applying Time : 5s±1s

Applied direction : Parallel to substrate

7-2ｰ3

Bending

Strength

It shall be soldered on the substrate.

Subatrate: Glass-epoxy 100mm40mm1.0mm

Deflection(n) : 2.0mm

Spped of Applying Force : 0.5mm/s

Keeping Time : 30s

7-2ｰ4

Vibration It shall be soldered on the substrate.

Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min

Total Amplitude : 1.5mm or Acceleration amplitude 196m/s

whichever is smaller.

Testing Time : A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 h)

7-2-5 Resistance

to Soldering

Heat

Pre-Heating : 150°C±10°C, 60s∼90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270°C±5°C

Immersion Time : 10s±0.5s

Immersion and emersion rates : 25mm/s

Then measured after exposure in the room condition for

48h±4h.

7-2ｰ6

Drop Products shall be no failure

after tested.

It shall be dropped on concrete or steel board.

Method : free fall

Height : 75cm

Attitude from which the product is dropped : 3 direction

The number of times : 3 times for each direction

(Total 9 times)

7-2-7 Solderability The electrodes shall be at

least 95% covered with new

solder coating.

Flux : Ethanol solution of rosin,25(wt)%

Pre-Heating : 150°C±10°C, 60s∼90s

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 240°C±5°C

Immersion Time : 3s±1s

Immersion and emersion rates : 25mm/s

Appearance No damage

Impedance

Change

(at 100MHz)

Within

±30%

Resistance

Meet item

45mm

R340

Deflection

45mm

Product

Pressure jig

R0.5

Ｆ

Substrate

Ｆ

Side view

Spec.No.JENF243A-0022H-01 P3/7

MURATA MFG.CO.,LTD.

Reference

Only

7-3. Environmental Performance

It shall be soldered on the substrate.

No. Item Specification Test Method

7-3-1 Temperature

Cycle

Meet Table 1. 1 cycle:

1 step:-55 °C(+0 °C,-3 °C) / 30min±3min

2 step:Ordinary temp. / within 3min

3 step:+125 °C(+3 °C,-0 °C) / 30min±3min

4 step: Ordinary temp. / within 3min

Total of 100 cycles

Then measured after exposure in the room condition for 48h±4h.

7-3-2 Humidity Temperature : 85°C±2°C

Humidity : 80%(RH) to 85%(RH)

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

7-3-3 Heat Life Temperature : 125°C±3°C

Applying Current : Rated Current

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

7-3-4 Cold

Resistance

Temperature : -55±2°C

Time : 1000h(+48h,-0h)

Then measured after exposure in the room condition for 48h±4h.

8. Specification of Packaging

8-1. Appearance and Dimensions (8mm-wide paper tape)

(in mm)

(1) Taping

Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed

by top tape and bottom tape.

(2) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(3) Spliced point

The base tape and top tape have no spliced point

(4) Cavity

There shall not be burr in the cavity.

(5) Missing components number

Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not

continuous. The specified quantity per reel are kept.

8-2. Tape Strength

(1) Pull Strength

Top tape

5N min.

Bottom tape

(2) Peeling off force of Top tape

0.1N to 0.6N (Minimum value is typical.)

*Speed of Peeling off:300mm/min

Top tape

Bottom tape

Base tape

165 to 180 degree



1.5

1.1max.

Direction of feed

4.0±0.1

1.85±0.1

2.0±0.05

3.5±0.05

1.75±0.1

8.0±0.3

+0.1

-0

1.05±0.1

P1-P3 P4-P6 P7-P7

BLM18GG471SN1D

Mfr. #:

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