0.102 ±0.001
2.60 ±0.02
0.165 ±0.002
4.20 ±0.05
0.128 ±0.001
3.24 ±0.02
0.009 ±0.001
0.23 ±0.02
0.019 ±0.001
0.48 ±0.02
0.020
0.50
BSC
0.157
4
BSC
0.157
4
BSC
1
2
3
PIN 1 DOT
BY MARKING
NOTE:1, 2, 3
0.033 ±0.002
0.85 ±0.05
0.001
+
0.001
0.000
0.02
+
0.030
0
0.008 ±0.001
0.203 ±0.025
NOTE:1, 2, 3
0.05
C
0.098 ±0.002
2.50 ±0.05
EXP.DAP
0.098 ±0.002
2.50 ±0.05
EXP.DAP
0.016 ±0.002
0.40 ±0.05
0.098
2.50
REF.
0.020
0.50
BSC
0.010 ±0.002
0.25 ±0.05
0.20
R0.008
1
2
NOTE:1, 2, 3
PIN #1 ID
Recommended Land Pattern
Notes:
1. Max Package warpage is 0.05mm.
2. Max allowable burr is 0.076mm in all directions.
3. Pin 1 is on top and will be laser marked.
4. Red circles in land pattern indicate thermal vias. Size should be 0.30-0.35M in
diameter and should be connected to GND for max thermal performance.
5. Green rectangles (shaded area) indicate solder stencil opening on exposed
pad area.Size should be 1.00 x 1.00 mm in size, 1.20mm pitch.
Pin No.
Configuration.
22
Q
23
/Q
3
REFIN
12
OE
1,20
VDD
17,24
VDDO
2,8,13,14
15,21
VSS
4,5,7,9
11,16,18
DNC
6,10,19
DNC
ePad
Exposed Pad
-
ABMJB-903
XXXXXX
-
WEIGHT:
A3
SHEET 1 OF 1
SCALE:10:1
DWG NO.
TITLE:
REVISION
DO NOT SCALE DRAWING
MATERIAL:
DATE
SIGNATURE
NAME
DEBUR AND
BREAK SHARP
EDGES
FINISH:
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN INCH(MM)
SURFACE FINISH:
TOLERANCES:
LINEAR:
ANGULAR:
Q.A
MFG
APPV'D
CHK'D
DRAWN
30332 Esperanza, Rancho Santa margarita, California 92688
