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PCK953BD,157

P1-P3P4-P6P7-P9P10-P12P13-P15
PCK953_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 9 October 2008 10 of 15
NXP Semiconductors
PCK953
20 MHz to 125 MHz PECL input, 9 CMOS output, 3.3 V PLL clock driver
13. Packing information
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
Table 8. Packing information
Type number Ordering code
(12NC)
Package Packing Description
PCK953BD 9352 679 41118 SOT358-1
(LQFP32)
reel pack, SMD, 13” 180° rotation package orientation
in reel
PCK953BD 9352 679 41128 SOT358-1
(LQFP32)
reel pack, SMD, 13”, turned JEDEC standard package orientation
in reel
PCK953BD 9352 679 41151 SOT358-1
(LQFP32)
tray pack, bakeable, single
PCK953BD 9352 679 41157 SOT358-1
(LQFP32)
tray pack, bakeable, multiple
PCK953BD/G 9352 761 22128 SOT358-1
(LQFP32)
reel pack, SMD, 13”, turned JEDEC standard package orientation
in reel
PCK953_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 9 October 2008 11 of 15
NXP Semiconductors
PCK953
20 MHz to 125 MHz PECL input, 9 CMOS output, 3.3 V PLL clock driver
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Table 9. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 10. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCK953_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 9 October 2008 12 of 15
NXP Semiconductors
PCK953
20 MHz to 125 MHz PECL input, 9 CMOS output, 3.3 V PLL clock driver
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 8. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 11. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
LPF Low-Pass Filter
LVCMOS Low Voltage Complementary Metal-Oxide Semiconductor
LVPECL Low Voltage Positive Emitter-Coupled Logic
LVTTL Low Voltage Transistor-Transistor Logic
PECL Positive Emitter-Coupled Logic
PLL Phase-Locked Loop
RC Resistor-Capacitor network
SPICE Simulation Program with Integrated Circuit Emphasis
VCO Voltage Controlled Oscillator
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PCK953BD,157

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NXP Semiconductors
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IC DRVR CLK PECL 3.3V 32LQFP
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