PCA9532 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 22 August 2016 25 of 31
NXP Semiconductors
PCA9532
16-bit I
2
C-bus LED dimmer
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15
and 16
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26
.
Table 15. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 16. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA9532 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 22 August 2016 26 of 31
NXP Semiconductors
PCA9532
16-bit I
2
C-bus LED dimmer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Abbreviations
MSL: Moisture Sensitivity Level
Fig 26. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 17. Abbreviations
Acronym Description
ACPI Advanced Configuration and Power Interface
CDM Charged Device Model
DSP Digital Signal Processor
DUT Device Under Test
ESD ElectroStatic Discharge
GPIO General Purpose Input/Output
HBM Human Body Model
I
2
C-bus Inter-Integrated Circuit bus
LED Light Emitting Diode
MCU MicroController Unit
MM Machine Model
MPU MicroProcessor Unit
POR Power-On Reset
RC Resistor-Capacitor network
SMBus System Management Bus
PCA9532 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 4.1 — 22 August 2016 27 of 31
NXP Semiconductors
PCA9532
16-bit I
2
C-bus LED dimmer
17. Revision history
Table 18. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9532 v.4.1 20160822 Product data sheet - PCA9532_4
Modifications:
Table 1: Corrected topside mark for PCA9532PW.
PCA9532_4 20090317 Product data sheet - PCA9532_3
Modifications:
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 5.1 “Pinning: replaced (old) Figure 1 with separate drawings for SO24 (Figure 2) and
TSSOP24 (Figure 3)
Table 2 “Pin description: added Table note [1] and its reference at HVQFN24 pin 9, V
SS
Section 6.2 “Control register:
2
nd
paragraph: changed from “The lowest 3 bits are ...” to “The lowest 4 bits are ...”
4
th
paragraph: changed from “... by reading a register different from ‘0’ ...” to “... by reading a
register different from INPUT0 ...”
Section 6.6 “External RESET, 1
st
paragraph, 1
st
sentence: changed symbol from “t
W
” to “t
w(rst)
Figure 11 “Write to register: symbol changed from “t
pv
” to “t
v(Q)
Figure 13 “Read input port register:
Symbol changed from “t
ph
” to “t
h(D)
Symbol changed from “t
ps
” to “t
su(D)
Table 12 “Limiting values: changed symbol/parameter from “I
I/O
, DC output current on an I/O”
to “I
O(LEDn)
, output current on pin LEDn”
Table 13 “Static characteristics:
Descriptive line below table title: 2
nd
sentence is moved to Table note [1], with its reference at
column heading “Typ”
I
DD
parameter changed from “additional standby current” to “additional quiescent supply
current”
Sub-section “I/Os”: symbol changed from “I
L
” to “I
LI
Table 14 “Dynamic characteristics:
Symbol/parameter changed from “t
PV
, Output data valid” to “t
v(Q)
, data output valid time”
Symbol/parameter changed from “t
PS
, Input data set-up time” to “t
su(D)
, data input set-up time”
Symbol/parameter changed from “t
PH
, Input data hold time” to “t
h(D)
, data input hold time”
Symbol changed from “t
W
” to “t
w(rst)
Symbol changed from “t
REC
” to “t
rec(rst)
Symbol/parameter changed from “t
RESET
, Time to reset” to “t
rst
, reset time”
Figure 19 “Definition of RESET timing:
Symbol changed from “t
REC
” to “t
rec(rst)
Symbol changed from “t
RESET
” to “t
rst
Symbol changed from “t
W
” to “t
w(rst)
Symbol changed from “t
RESET
” to “t
rst
Updated handling information
Added soldering information
PCA9532_3 20041001 Product data sheet - PCA9532_2
PCA9532_2
(9397 750 11459)
20030502 Product data ECN 853-2398 29860
dated 24 Apr 2003
PCA9532_1

PCA9532PW,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
LED Lighting Drivers 16-BIT I2C FM OD LED DIM RST
Lifecycle:
New from this manufacturer.
Delivery:
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