Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
C
AB
Preheating
Peak
Heating
Temperature
Time
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
<Repair with hand soldering>
●
Pr
eheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
●
Never touch this product with the tip of a soldering iron.
■ Recommended Land Pattern Dimensions in mm (not to scale)
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son
in advance.
3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance.
Excessive mechanical stress may damage the bead cores. Handle with care.
4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the out go ing in spec tion
indicated on the packages.
Part Number A B C
EXCCL4532U1
3 5.4 2.8
EXCCL3225U1
1.7 4.1 2.1
EXCCL3216U1
1.7 4.1 1.2
EXCML45A910H
2.6 to 3 5.5 to 6.5 1.2 to 1.6
EXCML32A680U
1.6 to 2 4 to 5 1.2 to 1.6
EXCML20A390U
0.8 to 1.2 3 to 4 1 to 1.2
EXCML16A270U
0.6 to 1 2 to 3 0.8 to 1
EXC3B□□□□H 0.8 to 1 2 to 2.6 0.8 to 1
(mm)
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Temperature Time
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
●
Recommended soldering conditions for refl ow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
●
Flow soldering
· Flow soldering may cause this product to come off beca
use the a
dhesiveness of the product element is low.
Please consult our sales representative in advance about fl ow soldering.
Nov. 201202
