TLP168J
2014-09-01
2
Absolute Maximum Ratings (Ta = 25°C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/ voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc.).
(Note 1) Device considered a two
−terminal device: Pins 1 and 3 shorted together and Pin 4 and 6 shorted together.
Recommended Operating Conditions
Characteristic Symbol Min Typ. Max Unit
Supply voltage V
AC
― ― 240 Vac
Forward current I
F
4.5 6 7.5 mA
Peak on−state current I
TP
― ― 1 A
Operating temperature T
opr
−10 ― 85 °C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Characteristic Symbol Rating Unit
LED
Forward current I
F
20 mA
Forward current derating (Ta ≥ 25°C) ∆I
F
/ °C −0.2 mA / °C
Peak forward current (100 μs pulse, 100 pps) I
FP
1 A
Reverse voltage V
R
5 V
Junction temperature T
j
125 °C
Detector
Off−state output terminal voltage V
DRM
600 V
On−state RMS current
Ta = 25°C
I
T(RMS)
70
mA
Ta = 70°C 40
On−state current derating (Ta ≥ 25°C) ∆I
T
/ °C −0.67 mA / °C
Peak on−state current
(100 μs pulse, 120 pps)
I
TP
2 A
Peak non-repetitive surge current
(P
W
=10 ms)
I
TSM
1.2 A
Junction temperature T
j
115 °C
Storage temperature range T
stg
−55 to 125 °C
Operating temperature range T
opr
−40 to 100 °C
Lead soldering temperature (10 s) T
sol
260 °C
Isolation voltage
(AC, 1 minute, R.H. ≤ 60%) (Note 1)
BV
S
2500 Vrms
