SQM40016EM_GE3

SQM40016EM
www.vishay.com
Vishay Siliconix
S17-1886-Rev. A, 01-Jan-18
1
Document Number: 76558
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Automotive N-Channel 40 V (D-S) 175 °C MOSFET
FEATURES
TrenchFET
®
power MOSFET
Package with low thermal resistance
100 % R
g
and UIS tested
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR4 material)
PRODUCT SUMMARY
V
DS
(V) 40
R
DS(on)
() at V
GS
= 10 V 0.00100
I
D
(A) 250
Configuration Single
Package TO-263-7L
TO-263 7-Lead
Top View
G
D
S
S
S
S
S
Drain conntected
to tab
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
40
V
Gate-source voltage V
GS
± 20
Continuous drain current
T
C
= 25 °C
a
I
D
250
A
T
C
= 125 °C 229
Continuous source current (diode conduction)
a
I
S
250
Pulsed drain current
b
I
DM
420
Single pulse avalanche current
L = 0.1 mH
I
AS
78
Single pulse avalanche energy E
AS
304 mJ
Maximum power dissipation
b
T
C
= 25 °C
P
D
300
W
T
C
= 125 °C 100
Operating junction and storage temperature range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount
c
R
thJA
40
°C/W
Junction-to-case (drain) R
thJC
0.5
SQM40016EM
www.vishay.com
Vishay Siliconix
S17-1886-Rev. A, 01-Jan-18
2
Document Number: 76558
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 40 - -
V
Gate-source threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.5 3.0 3.5
Gate-source leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero gate voltage drain current I
DSS
V
GS
= 0 V V
DS
= 40 V - - 1
μA
V
GS
= 0 V V
DS
= 40 V, T
J
= 125 °C - - 50
V
GS
= 0 V V
DS
= 40 V, T
J
= 175 °C - - 500 μA
On-state drain current
a
I
D(on)
V
GS
= 10 V V
DS
5 V 100 - - A
Drain-source on-state resistance
a
R
DS(on)
V
GS
= 10 V I
D
= 40 A - 0.00081 0.00100
V
GS
= 10 V I
D
= 40 A, T
J
= 125 °C - - 0.00152
V
GS
= 10 V I
D
= 40 A, T
J
= 175 °C - - 0.00184
Forward transconductance
b
g
fs
V
DS
= 15 V, I
D
= 40 A - 181 - S
Dynamic
b
Input capacitance C
iss
V
GS
= 0 V V
DS
= 25 V, f = 1 MHz
- 10 841 15 000
pF Output capacitance C
oss
- 2928 4000
Reverse transfer capacitance C
rss
- 198 270
Total gate charge
c
Q
g
V
GS
= 10 V V
DS
= 20 V, I
D
= 100 A
- 163 245
nC Gate-source charge
c
Q
gs
-46-
Gate-drain charge
c
Q
gd
-36-
Gate resistance R
g
f = 1 MHz 1 2.2 3.4
Turn-on delay time
c
t
d(on)
V
DD
= 20 V, R
L
= 0.2
I
D
100 A, V
GEN
= 10 V, R
g
= 1
-2440
ns
Rise time
c
t
r
- 215 330
Turn-off delay time
c
t
d(off)
-5990
Fall time
c
t
f
-3555
Source-Drain Diode Ratings and Characteristics
b
Pulsed current
a
I
SM
- - 420 A
Forward voltage V
SD
I
F
= 60 A, V
GS
= 0 V - 0.8 1.5 V
Body diode reverse recovery time t
rr
I
F
= 40 A, di/dt = 100 A/μs
- 92 185 ns
Body diode reverse recovery charge Q
rr
- 198 400 nC
Reverse recovery fall time t
a
-47-
ns
Reverse recovery rise time t
b
-45-
Body diode peak reverse recovery current I
RM(REC)
--4.4- A
SQM40016EM
www.vishay.com
Vishay Siliconix
S17-1886-Rev. A, 01-Jan-18
3
Document Number: 76558
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
Transconductance
Capacitance
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
50
100
150
200
250
0246810
2nd line
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
2nd line
V
GS
= 10 V thru 6 V
V
GS
= 4 V
V
GS
= 5 V
10
100
1000
10000
0
50
100
150
200
250
0 1224364860
Axis Title
1st line
2nd line
2nd line
g
fs
- Transconductance (S)
I
D
- Drain Current (A)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
3600
7200
10 800
14 400
18 000
0 8 16 24 32 40
Axis Title
1st line
2nd line
2nd line
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
2nd line
C
rss
C
oss
C
iss
10
100
1000
10000
0
30
60
90
120
150
02468
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
0.0000
0.0006
0.0012
0.0018
0.0024
0.0030
0 20406080100
2nd line
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
2nd line
V
GS
= 10 V
10
100
1000
10000
0
2
4
6
8
10
04080120160200
Axis Title
1st line
2nd line
2nd line
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
2nd line
I
D
= 100 A
V
DS
= 20 V

SQM40016EM_GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 40V Vds 20V Vgs D2PAK (TO-263-7L)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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