MC74HC126ANG

MC74HC125A, MC74HC126A
http://onsemi.com
4
SWITCHING WAVEFORMS
Figure 1.
Figure 2.
OUTPUT Y
50%
50%
50%
50%
90%
10%
V
CC
V
CC
GND
GND
HIGH
IMPEDANCE
V
OL
V
OH
OUTPUT Y
OUTPUT Y
OE (HC125A)
OE (HC126A)
t
PZL
t
PLZ
t
PZH
t
PHZ
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 3. Test Circuit
*Includes all probe and jig capacitance
Figure 4. Test Circuit
OUTPUT
TEST POINT
C
L
*
1 kW
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL.
CONNECT TO GND WHEN
TESTING t
PHZ
and t
PZH.
DEVICE
UNDER
TEST
HIGH
IMPEDANCE
90%
10%
50%
90%
50%
10%
V
CC
GND
t
f
t
r
t
PLH
t
PHL
t
TLH
t
THL
INPUT A
HC125A
(1/4 OF THE DEVICE)
HC126A
(1/4 OF THE DEVICE)
OE
A
V
CC
Y
OE
A
V
CC
Y
MC74HC125A, MC74HC126A
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
MC74HC125ADG SOIC−14 NB
(Pb−Free)
55 Units / Rail
MC74HC125ADR2G SOIC−14 NB
(Pb−Free)
2500 / Tape & Reel
MC74HC125ADTG TSSOP−14
(Pb−Free)
96 Units / Rail
MC74HC125ADTR2G TSSOP−14
(Pb−Free)
2500 / Tape & Reel
MC74HC126ADG SOIC−14 NB
(Pb−Free)
55 Units / Rail
MC74HC126ADR2G SOIC−14 NB
(Pb−Free)
2500 / Tape & Reel
MC74HC126ADTR2G TSSOP−14
(Pb−Free)
2500 / Tape & Reel
NLV74HC125ADG* SOIC−14 NB
(Pb−Free)
55 Units / Rail
NLV74HC125ADR2G* SOIC−14 NB
(Pb−Free)
2500 / Tape & Reel
NLV74HC125ADTG* TSSOP−14
(Pb−Free)
55 Units / Rail
NLV74HC125ADTR2G* TSSOP−14
(Pb−Free)
2500 / Tape & Reel
NLV74HC126ADR2G* SOIC−14 NB
(Pb−Free)
2500 / Tape & Reel
NLV74HC126ADTR2G* TSSOP−14
(Pb−Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
MC74HC125A, MC74HC126A
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

MC74HC126ANG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers 2-6V Quad 3-State Non-Inverting
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union