SURFBOARDS
R
THE BREADBOARDING MEDIUM FOR SURFACE MOUNT TM
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, INLINOIS. USA PHONE 630-690-1696 FAX 630-690-2498
WWW.CapitalAdanced.Com
Copyright 2011 by Capital Advanced Technologies, Inc. All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, and the Leaf Circuit Logo
are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All information given is believed to
be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for a given purpose. No inducement is
intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
MADE
IN
USA
33000 SERIES APPLICATION SPECIFIC ADAPTERS
33106
MODEL
FIG. MM IN. NOTE:
A
15.24 .600
BOARD WIDTH +- .5mm .020in.
B
8.89 .350
BOARD HEIGHT +-.5mm .020in.
C
2.54 .100
SIP PIN SPACE +-.20mm .008in.
D
1.4 .055 PAD CENTERLINE
E .35
.014
DEVICE LEAD PITCH
F
1.1 .043 PAD LENGTH
G
.2 .008 PAD WIDTH
I
2.2 .087
MAX LEAD WIDTH
J
1.0 .039
TYPICAL LEAD WIDTH
P
3.3 .130
LENGTH FROM SHOULDER +-.5mm .020in.
S
1.57 .062 PIN SHOULDER HEGHT
W
.5 .020 PIN WIDTH
H
.3 .012 GAP
J1
.9 .035
VARIATION LEAD WIDTH
MOUNTING PADS ARE OVERSIZED IN LENGTH TO
ACCEPT A WIDER RANGE OF DEVICE WIDTHS AND
TOLERANCES AND TO PERMIT HAND SOLDERING.
SEE WEBSITE FOR SOLDERING SUGGESTIONS
SINGLE-IN-LINE ( SIP ) PINS
ON .100 in. CENTERS
PAD SET
EXAMPLE DEVICE ( J )
AND MAX WIDTH ( I )
BOARD SPECIFICATIONS
BOARD MATERIAL: .8mm, +-.13mm .031in+-..005 in.
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS: 1 oz. Copper with RoHS compliant Lead Free
solder coating. Patten Position on board +- .5mm .020in.
TOLERANCES: If not noted are +- 20%. Nominal values are given. Controlling unit is Millimeters.
Values rounded to nearest decimal. Slight Variations due to manufacturing process can occur.
ACCEPTS SOT-963
Feature Pins on .1 in. Centers designed for use with
Solderless breadboards, Conventional Breadboards,
and Sockets with standard .1 in. centers. Use For
Prototyping, Device Test or Evaluation and SMD to
Through Hole Conversion.
6 LEAD .35 mm PITCH DEVICES
IDS33106
ON SEMI
ULLGA6 1.0x1.0,0.35P
PANASONIC
SSSMini6-F1
TEXAS NST.
DSF (S-PDSO-N6)
DSF (S-PX2SON-N6)
TOSHIBA
CST6, FS6
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
PARTIAL LISTING
RoHS
Compliant
EC 2002/95
DEVICE LEAD WIDTH .9, 1.0, To Max 2.2 MM
DRAWINGS
NOT TO
SCALE
REV A- 10-2011
