RHYTHM R3710
www.onsemi.com
18
PACKAGE DIMENSIONS
SIP16 4.57x3.12
CASE 127DX
ISSUE O
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BUMPS.
4. DIMENSION b IS MEASURED AT THE MAXI-
MUM BUMP DIMENSION PARALLEL TO DA-
TUM C.
DIM
A
MIN MAX
−−−
MILLIMETERS
A1
b
e
e1 0.699 BSC
1.524
A B
PIN 1
INDICATOR
e
A0.05 BC
0.03
C
0.05 C
16X
b
0.13 C
A1
C
0.052 0.152
0.711 BSC
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
RECOMMENDED
14
1
A
6
e1
A2
9
NOTE 4
D
3.124 BSC
D2
A2
0.343 BSC
−−− 1.372
0.503 0.536
L 0.503 0.536
E
E2
0.356 BSC
4.572 BSC
0.13 C
0.13 C
D
E
E2
D2
A0.05 BC
0.03
C
16X
L
NOTE 4
0.550
16X
DIMENSIONS: MILLIMETERS
0.711
0.699
PACKAGE
OUTLINE
PITCH
PITCH
1
0.550
16X
0.712
0.686
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R3710/D
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