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BZW06-23B
P1-P3
P4-P6
P7-P9
Characteristics
BZW06
4/9
DocID2972 Rev
4
1.1
Characteristics
(curves)
Figure 2: Pulse waveform (10/1000
μs)
Figure 3: Peak pulse power dissipation versus
initial junction temperature
Figure 4: Peak pulse power versus exponential
pulse duration
Figure 5: Clamping voltage versus peak pulse
current (maximum values).
Figure 6: Junction capacitance versus reverse
applied voltage (unidirectional ty
pes
)
100
50
0
%
I
pp
t
1000 µs
Pulse waveform 10
/1000 µs
10 µs
0
100
200
300
400
500
600
700
0
25
50
75
100
125
150
175
200
T
j
(°C
)
10/1000 µs
P
PP
(W)
0.1
1.0
10.0
100.0
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
t
P
(m
s)
T
j
initial = 25 °
C
P
PP
(kW)
0.1
1.0
10
.0
10
0.0
10
00.0
1
10
10
0
10
00
V
C
L
(V
)
10/1000
µs
T
j
initial = 25 °C
8/20 µs
10 ms
BZW06-
5V8
BZW06-85
BZW06-10
BZW06-19
BZW06-33
BZW06-58
BZW06-376
BZW06-188
I
PP
(A)
10
10
0
10
00
10
000
1
10
10
0
10
00
V
R
(V
)
C(pF
)
F = 1 M
Hz
V
os
c
= 30 mV
RM
S
T
j
= 25 °C
BZW06-5V8
BZW06-13
BZW06-58
BZW06-171
BZW06
Characteristics
DocID2972 Rev
4
5/9
Figure 7: Junction capacitance versus reverse
applied voltage (bidirectional types)
Figure 8: Peak forward voltage drop versus peak
forward current
Figure 9: Relative variation of thermal impedance
junction to ambient versus pulse duration
(printed circuit board FR4, e
CU
= 35 µm)
Figure
10
: Leakage current versus junction
temperature
10
10
0
10
00
10
000
1
10
100
10
00
V
R
(V
)
C(pF
)
F = 1 MH
z
V
os
c
= 30 mV
RM
S
T
j
= 25 °C
BZW06-5V
8B
BZW06-13B
BZW06-58B
BZW06-171B
1.0
E-02
1.0
E-01
1.0
E+0
0
1.0
E+0
1
1.0
E+0
2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
V
FM
(V
)
T
j
= 25 °C
T
j
= 125 °C
I
FM
(A)
1.0E
-03
1.0
E-02
1.0E
-01
1.0E
+00
1.0
E-02
1.0
E-01
1.0
E+0
0
1.0E
+01
1.0
E+0
2
1.0
E+0
3
t
P
(s
)
Recommend
ed pad layout
Z
th(j-a)
/R
th(j-a)
1.E
-01
1.E
+00
1.E
+01
1.E
+02
1.E
+03
1.E
+04
25
50
75
10
0
12
5
15
0
17
5
T
j
(°
C
)
V
R
= V
RM
V
BR
> 10 V
V
R
= V
RM
V
BR
< 10 V
I
R
(nA)
Package
inform
ation
BZW06
6/9
DocID2972 Rev
4
2
Package informatio
n
In order to meet en
vironmental requ
irements, ST
of
fers these devices in diff
erent grades of
ECOPACK
®
packages, dep
ending on their level of
environm
ental compliance. EC
OPACK
®
specifications, grade d
efinitions and product st
atus are available
at:
www.st.com
.
ECOPACK
®
is an ST tradem
ark.
2.1
DO
-15 package info
r
mation
Figure
11
: DO-15 package outline
Table 5: DO-15 package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
T
y
p.
Max.
Min.
T
y
p.
Max.
b
0.71
-
0.88
0.028
-
0.035
D
2.95
-
3.53
0.116
-
0.139
G
6.05
-
6.75
0.238
-
0.266
L
26
-
31
1.024
-
1.22
P1-P3
P4-P6
P7-P9
BZW06-23B
Mfr. #:
Buy BZW06-23B
Manufacturer:
STMicroelectronics
Description:
ESD Suppressors / TVS Diodes 600W 23V Bidirect
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
Paypal
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MoneyGram
Western
Union
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