HMC362

FREQUENCY DIVIDERS - CHIP
1
1 - 11
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Pad Description
Pad Number Function Description Interface Schematic
1
IN
RF Input 180° out of phase with pad 3 for differential operation.
AC ground for single ended operation.
2 IN RF Input must be DC blocked.
3, 4, 5 Vcc Supply Voltage 5V ±0.25V can be applied to pad 3, 4, or 5.
6OUT Divided Output
7 OUT Divided output 180° out of phase with OUT.
8PWR SEL
In the low power mode, the power select pin is left  oating.
By grounding this pin, the output power is increased by
approximately 10 dB.
9PWR DWN
The power down pin is grounded for normal operation.
Applying 5 volts to this pin will power down this device.
10 DISABLE
The disable pin is grounded for normal operation.
Applying 5 volts to this pin will disable the input buffer ampli er.
HMC362
v04.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 11 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY DIVIDERS - CHIP
1
1 - 12
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Truth Table
Assembly Diagram
AC coupling capacitors.
To +5V Vcc Supply
(Bypassed via 10 uF Capacitor).
AC coupling capacitors.
Optional AC coupled
differential input. Should
be AC grounded for
single ended operation.
Optional AC coupled
differential output. For best
single ended reverse leakage
performance, this port should
be terminated into 50 ohm.
This port should be grounded
for normal operation. Applying
+5V to this port will disable the
input buffer ampli er.
This port should be grounded
for normal operation. Applying
+5V to this port will power
down the device.
For high power output, this
port should be bonded to
ground. For low power output,
this port should be  oating.
Function Pin 5V GND Float
DISABLE 10 Output Off Output On X
PWR
DWN
9
Power
Down
Power
Up
X
PWR
SEL
8X
High
Power
Output
Low
Power
Output
X = State not permitted.
HMC362
v04.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 11 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
FREQUENCY DIVIDERS - CHIP
1
1 - 13
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or  ngers.
Mounting
The chip is back-metallized and can be die mounted with with electrically conductive epoxy. The mounting surface should be
clean and  at.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy  llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31 mm (12 mils).
HMC362
v04.0109
GaAs HBT MMIC
DIVIDE-BY-4, DC - 11 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D

HMC362

Mfr. #:
Manufacturer:
Analog Devices / Hittite
Description:
Prescaler InGaP HBT Divide-by-4 Chip, DC - 11 GHz
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet