NSR0240P2T5G
www.onsemi.com
3
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN NOM MAX
MILLIMETERS
A 0.34 0.37 0.40
b 0.15 0.20 0.25
c 0.07 0.12 0.17
D 0.75 0.80 0.85
E 0.55 0.60 0.65
0.95 1.00 1.05
L 0.19 REF
H
E
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
MIN NOM MAX
INCHES
D
E
c
A
−Y−
−X−
21
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
See Application Note AND8455/D for more mounting details
1.20
2X
0.25
2X
0.36
PACKAGE
OUTLINE
b2X
0.08 XY
TOP VIEW
H
E
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
L2 0.05 0.10 0.15 0.002 0.004 0.006
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