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EMI8041BMUTAG
P1-P3
P4-P6
P7-P9
P10-P10
EMI8041, EMI8042, EMI8043
www
.onsemi.com
7
P
ACKAGE DIMENSIONS
UDFN6 1.6x1.35, 0.5P
CASE 517DG
ISSUE O
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETERS.
3.
DIMENSION b APPLIES TO PLA
TED
TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP
.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
C
NOTE 3
2X
0.10
C
PIN ONE
REFERENCE
TOP
VIEW
2X
0.10
C
A
A1
0.08
C
0.10
C
C
SEA
TING
PLANE
SIDE VIEW
L
3X
1
3
4
6
DIM
MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
b
0.15
0.25
D
1.60 BSC
E
1.35 BSC
e
0.50 BSC
L2
0.65
0.85
L
0.35
0.55
*For
additional information on our Pb−Free strategy and soldering
details, please download the
ON Semiconductor Soldering and
Mounting T
echniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT
DET
AIL A
RECOMMENDED
DET
AIL A
6X
L2
3X
1.55
0.50
0.56
3X
DIMENSIONS: MILLIMETERS
0.32
1
6X
PITCH
0.86
3X
EMI8041, EMI8042, EMI8043
www
.onsemi.com
8
P
ACKAGE DIMENSIONS
XDFN6, 1.50x1.35, 0.5P
CASE 71
1A
Y
ISSUE O
DIM
MIN
MAX
MILLIMETERS
A
A1
0.00
0.05
A3
b
0.15
0.25
D
1.50 BSC
E
1.35 BSC
e
0.50 BSC
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETERS.
3.
DIMENSIONS b APPLIES TO PLA
TED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP
.
0.15 REF
b
L
PIN 1
1
4
3
D
E
B
A
C
0.10
C
0.10
2X
2X
6
e
3X
6X
NOTE 3
A
A1
(A3)
SEA
TING
PLANE
C
0.08
C
0.10
0.40
0.50
L
0.35
0.55
REFERENCE
TOP
VIEW
SIDE VIEW
BOTTOM VIEW
0.32
0.86
1.55
0.50
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT
5X
RECOMMENDED
DET
AIL A
B
A
C
C
M
0.10
M
0.05
L1
---
0.15
DET
AIL B
3X
0.51
DET
AIL B
MOLD CMPD
EXPOSED Cu
AL
TERNATE
CONSTRUCTION
6X
C
PITCH
1
L2
0.65
0.85
L3
0.15 REF
L3
L2
3X
L1
DET
AIL A
L
AL
TERNATE
CONSTRUCTIONS
L
0.56
3X
EMI8041, EMI8042, EMI8043
www
.onsemi.com
9
P
ACKAGE DIMENSIONS
XDFN10 2.50x1.35, 0.5P
CASE 71
1AX
ISSUE O
DIM
MIN
MAX
MILLIMETERS
A
A1
0.00
0.05
A3
b
0.15
0.25
D
2.50 BSC
E
1.35 BSC
e
0.50 BSC
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
CONTROLLING DIMENSION: MILLIMETERS.
3.
DIMENSIONS b APPLIES TO PLA
TED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP
.
0.15 REF
b
L
PIN ONE
1
6
5
D
E
B
A
C
0.10
C
0.10
2X
2X
10
e
10X
10X
NOTE 3
A
C
A1
(A3)
SEA
TING
PLANE
C
0.08
C
0.10
0.40
0.50
L
0.40
0.60
REFERENCE
TOP
VIEW
SIDE VIEW
BOTTOM VIEW
0.25
0.65
1.55
0.50 PITCH
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT
9X
1
RECOMMENDED
DET
AIL A
B
A
C
C
M
0.10
M
0.05
L1
---
0.15
DET
AIL B
8X
0.47
PACKAGE
OUTLINE
L1
DET
AIL A
L
AL
TERNATE
CONSTRUCTIONS
L
DET
AIL B
MOLD CMPD
EXPOSED Cu
AL
TERNATE
CONSTRUCTION
P1-P3
P4-P6
P7-P9
P10-P10
EMI8041BMUTAG
Mfr. #:
Buy EMI8041BMUTAG
Manufacturer:
ON Semiconductor
Description:
CMC 100MA 2LN SMD
Lifecycle:
New from this manufacturer.
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EMI8041BMUTAG
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