LX5501A
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright © 2004
Rev. 1.1, 2005-07-14
WWW.Microsemi .COM
InGAP HBT Gain Block
TM
®
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage............................................................................................6V
Collector Current ........................................................................................100mA
RF Input Power...........................................................................................10dBm
Operating Temperature Range...........................................................-40 to +85°C
Storage Temperature Range...........................................................-65°C to 150°C
Peak Package Solder Reflow Temp. (40 second max. exposure) ... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
PACKAGE PIN OUT
RF Output
/ VCC
GND
GND
RF Input
GND
1
2
34
5
SE
P
ACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
FUNCTIONAL PIN DESCRIPTION
Pin No. Description
1 Ground
2 Ground
3 RF Input
4 Ground
5 RF Output/VCC Supply
RECOMMENDED OPERATING CONDITIONS
LX5501A
Parameter Symbol
Min Typ Max
Units
`
Supply Voltage (with appropriate external resistor) VCC 3.5 6 V
Quiescent Current (No RF input) Icq 10 40 mA
ELECTRICAL CHARACTERISTICS
Conditions: +25°C, 5V supply voltage.
LX5501A
Parameter Symbol Test Conditions
Min Typ Max
Units
`
GENERAL SPECIFICATIONS (FIG 1. TEST CIRCUIT)
Small Signal Gain S21 Frequency = 5.8 GHz 11.4 dB
P1dB Compression P1dB Frequency = 5.8 GHz 11.5 dBm
Input Return Loss S11 Frequency = 2.4-6 GHz -10 dB
Output Return Loss S22 Frequency = 2.4-6 GHz -10 dB
Isolation S12 Frequency = 2.4-6 GHz -20 dB
Harmonics Frequency = 5.8 GHz, Pout = 10 dBm -30 dBC
Quiescent Current Icq 30 mA
E
E
L
L
E
E
C
C
T
T
R
R
I
I
C
C
A
A
L
L
S
S
