IRF6724MTRPBF

www.irf.com 1
04/30/09
Fig 1. Typical On-Resistance Vs. Gate Voltage
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
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Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.051mH, R
G
= 25, I
AS
= 21A.
Notes:
IRF6724MPbF
IRF6724MTRPbF
DirectFET Power MOSFET
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
Typical values (unless otherwise specified)
l RoHs Compliant and Halogen Free
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible
l Ultra Low Package Inductance
l Optimized for High Frequency Switching
l Ideal for CPU Core DC-DC Converters
l Optimized for Sync. FET socket of Sync. Buck Converter
l Low Conduction and Switching Losses
l Compatible with existing Surface Mount Techniques
l 100% Rg tested
Description
The IRF6724MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to achieve
the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible
with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6724MPbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6724MPbF has been optimized for parameters that are critical in synchronous buck
including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6724MPbF offers particularly low Rds(on) and high Cdv/dt
immunity for synchronous FET applications.
V
DSS
V
GS
R
DS(on)
R
DS(on)
30V max ±20V max
1.9m@ 10V 2.7m@ 4.5V
0 20406080100
Q
G
Total Gate Charge (nC)
0
2
4
6
8
10
12
V
G
S
,
G
a
t
e
-
t
o
-
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
V
DS
= 24V
VDS= 15V
I
D
= 21A
2.0 4.0 6.0 8.0 10.0
V
GS
, Gate-to-Source Voltage (V)
0
2
4
6
8
T
y
p
i
c
a
l
R
D
S
(
o
n
)
(
m
)
T
J
= 25°C
T
J
= 125°C
I
D
= 27A
Q
g tot
Q
gd
Q
gs2
Q
rr
Q
oss
V
gs(th)
33nC 10nC 3.9nC 34nC 20nC 1.8V
SQ SX ST MQ
MX
MT MP
Absolute Maximum Ratin
g
s
Parameter Units
V
DS
Drain-to-Source Voltage V
V
GS
Gate-to-Source Voltage
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
A
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current
E
AS
Single Pulse Avalanche Energy mJ
I
AR
Avalanche Current A
21
12
Max.
21
150
212
±20
30
27
DirectFET ISOMETRIC
MX
PD -97131A
IRF6724MPbF
2 www.irf.com
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400µs; duty cycle 2%.
Notes:
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
BV
DSS
Drain-to-Source Breakdown Voltage 30 ––– ––– V
∆ΒV
DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 22 ––– mV/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 1.90 2.50
m
––– 2.70 3.50
V
GS(th)
Gate Threshold Voltage 1.35 1.8 2.35 V
V
GS(th)
/T
J
Gate Threshold Voltage Coefficient ––– -6.1 ––– mV/°C
I
DSS
Drain-to-Source Leakage Current ––– ––– 1.0 µA
––– ––– 150
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
gfs Forward Transconductance 130 ––– ––– S
Q
g
Total Gate Charge ––– 33 54
Q
gs1
Pre-Vth Gate-to-Source Charge ––– 8.5 –––
Q
gs2
Post-Vth Gate-to-Source Charge ––– 3.9 ––– nC
Q
gd
Gate-to-Drain Charge ––– 10 –––
Q
godr
Gate Charge Overdrive ––– 11 ––– See Fig. 15
Q
sw
Switch Charge (Q
gs2
+ Q
gd
)
––– 14 –––
Q
oss
Output Charge ––– 20 ––– nC
R
G
Gate Resistance ––– 1.2 2.2
t
d(on)
Turn-On Delay Time ––– 11 –––
t
r
Rise Time ––– 19 –––
t
d(off)
Turn-Off Delay Time ––– 23 ––– ns
t
f
Fall Time ––– 16 –––
C
iss
Input Capacitance ––– 4404 –––
C
oss
Output Capacitance ––– 885 ––– pF
C
rss
Reverse Transfer Capacitance ––– 424 –––
Diode Characteristics
Parameter Min. Typ. Max. Units
I
S
Continuous Source Current ––– ––– 150
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– 212
(Body Diode)
V
SD
Diode Forward Voltage ––– ––– 1.0 V
t
rr
Reverse Recovery Time ––– 20 30 ns
Q
rr
Reverse Recovery Charge ––– 34 51 nC
di/dt = 300A/µs
T
J
= 25°C, I
S
= 21A, V
GS
= 0V
showing the
integral reverse
p-n junction diode.
V
GS
= 4.5V, I
D
= 21A
V
DS
= V
GS
, I
D
= 100µA
T
J
= 25°C, I
F
=21A
V
GS
= 4.5V
I
D
= 21A
V
GS
= 0V
V
DS
= 15V
I
D
= 21A
V
DD
= 15V, V
GS
= 4.5V
Conditions
V
GS
= 0V, I
D
= 250µA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 27A
V
GS
= 20V
V
GS
= -20V
V
DS
= 24V, V
GS
= 0V
V
DS
= 15V
V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
MOSFET symbol
R
G
= 1.8
V
DS
= 15V, I
D
=21A
Conditions
ƒ = 1.0MHz
V
DS
= 16V, V
GS
= 0V
IRF6724MPbF
www.irf.com 3
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Notes:
R
θ
is measured at T
J
of approximately 90°C.
Surface mounted on 1 in. square Cu
(still air).
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100
t
1
, Rectangular Pulse Duration (sec)
0.01
0.1
1
10
100
T
h
e
r
m
a
l
R
e
s
p
o
n
s
e
(
Z
t
h
J
A
)
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Ri (°C/W)
τι
(sec)
0.99292 0.000074
2.171681 0.007859
24.14602 0.959
17.69469 32.6
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci
i
/
Ri
Ci= τi/Ri
τ
a
τ
4
τ
4
R
4
R
4
Absolute Maximum Ratin
g
s
Parameter Units
P
D
@T
A
= 25°C
Power Dissipation
W
P
D
@T
A
= 70°C
Power Dissipation
P
D
@T
C
= 25°C
Power Dissipation
T
P
Peak Soldering Temperature °C
T
J
Operating Junction and
T
STG
Storage Temperature Range
Thermal Resistance
Parameter Typ. Max. Units
R
θJA
Junction-to-Ambient ––– 45
R
θJA
Junction-to-Ambient 12.5 –––
R
θJA
Junction-to-Ambient 20 ––– °C/W
R
θJC
Junction-to-Case ––– 1.4
R
θJ-PCB
Junction-to-PCB Mounted 1.0 ––
Linear Derating Factor
W/°C
0.022
270
-40 to + 150
Max.
89
2.8
1.8

IRF6724MTRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 30V 1 N-CH HEXFET 2.5mOhms 33nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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