DocID12359 Rev 3 5/9
STTH3R02 Ordering information scheme
9
2 Ordering information scheme
Figure 15. Ordering information scheme
Figure 11. Dynamic parameters versus junction
temperature
Figure 12. Thermal resistance junction to
ambient versus copper surface under each lead
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
I
RM
Q
RR
I
F
=3A
V
R
=160V
T
j
(°C)
R
th(j-a)
(°C/W)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DO-201AD
DO-15
S
Cu
(cm²)
Epoxy printed circuit board FR4, e = 35 µm
CU
Figure 13. Thermal resistance versus copper
surface under each lead for SMC
Figure 14. Thermal resistance versus lead
length for DO-201AD package
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMC
S
CU
(cm²)
Epoxy printed circuit board FR4, e = 35 µm
CU
0
10
20
30
40
50
60
70
80
90
100
5 10152025
R
th
(°C/W)
DO-201AD
R
th(j-a)
R
th(j-l)
L
leads
(mm)
STTH 3 R 02 XXX
Ultrafast switching diode
Average forward current
3 = 3 A
02 = 200 V
Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel
Model R
Package
Repetitive peak reverse voltage
