NCN2612BMTTWG

NCN2612B
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4
PIN FUNCTION AND DESCRIPTION
Pin Name Description
6, 17, 22, 27,
34,50, 55
VDD DC Supply, 3.3 V $10%
1, 11, 16, 20, 21,
28, 29, 35, 48,
49, 56
GND Power Ground.
Exposed Pad The exposed pad on the backside of package is internally connected to Gnd. Externally the exposed
pad should also be userconnected to GND.
2 SEL SEL controls the mux through a flowthrough latch. Do not float this pin.
SEL = 0 for PCIE Mode; SEL = 1 for DP Mode
3 LE LE controls the latch gate. Do not float this pin.
4 IN_0+ Differential input from GMCH PCIE outputs. IN_0+ makes a differential pair with IN_0.
5 IN_0 Differential input from GMCH PCIE outputs. IN_0 makes a differential pair with IN_0+.
7 IN_1+ Differential input from GMCH PCIE outputs. IN_1+ makes a differential pair with IN_1.
8 IN_1 Differential input from GMCH PCIE outputs. IN_1 makes a differential pair with IN_1+.
9 IN_2+ Differential input from GMCH PCIE outputs. IN_2+ makes a differential pair with IN_2.
10 IN_2 Differential input from GMCH PCIE outputs. IN_2 makes a differential pair with IN_2+.
12 IN_3+ Differential input from GMCH PCIE outputs. IN_3+ makes a differential pair with IN_3.
13 IN_3 Differential input from GMCH PCIE outputs. IN_3 makes a differential pair with IN_3+.
14 OUT+ Passthrough output from AUX+ input when SEL = 1. Passthrough output from Rx0+ input when
SEL = 0.
15 OUT Passthrough output from AUX input when SEL = 1. Passthrough output from Rx0 input when
SEL = 0.
18 X+ X+ is an analog passthrough output corresponding to Rx1+.
19 X X is an analog passthrough output corresponding to the Rx1 input. The path
from Rx1 to X must be matched with the path from Rx1+ to X+. X+ and X form a
differential pair when the passthrough mux mode is selected.
23 Rx1 Differential input from PCIE connector or device. Rx1 makes a differential pair with Rx1+. Rx1 is
passed through to the X pin on the path that matches the Rx1+ to X+ pin.
24 Rx1+ Differential input from PCIE connector or device. Rx1+ makes a differential pair with Rx1. Rx1+ is
passed through to the X+ pin when SEL = 0.
25 Rx0 Differential input from PCIE connector or device. Rx0 makes a differential pair with Rx0+. Rx0 is
passed through to the OUT pin when SEL = 0.
26 Rx0+ Differential input from PCIE connector or device. Rx0+ makes a differential pair with Rx0. Rx0+ is
passed through to the OUT+ pin when SEL = 0.
30 HPD2 Negative low frequency HPD input handshake protocol signal (normally not connected).
31 HPD1 Positive low frequency HPD input handshake protocol signal.
32 AUX Differential input from HDMI/DP connector. AUX makes a differential
pair with AUX+. AUX is passed through to the OUT pin when SEL = 1.
33 AUX+ Differential input from HDMI/DP connector. AUX+ makes a differential
pair with AUX. AUX+ is passed through to the OUT+ pin when SEL = 1.
37, 36 Tx3+, Tx3 Analog passthrough output#2 corresponding to IN_3+ and IN_3 when SEL = 0.
39, 38 Tx2+, Tx2 Analog passthrough output#2 corresponding to IN_2+ and IN_2 when SEL = 0.
41, 40 Tx1+, Tx1 Analog passthrough output#2 corresponding to IN_1+ and IN_1 when SEL = 0.
43, 42 Tx0+, Tx0 Analog passthrough output#2 corresponding to IN_0+ and IN_0 when SEL = 0.
45, 44 D3+, D3 Analog passthrough output#1 corresponding to IN_3+ and IN_3, when SEL = 1.
47, 46 D2+, D2 Analog passthrough output#1 corresponding to IN_2+ and IN_2, when SEL = 1.
52, 51 D1+, D1 Analog passthrough output#1 corresponding to IN_1+ and IN_1, when SEL = 1.
54, 53 D0+, D0 Analog passthrough output#1 corresponding to IN_0+ and IN_0, when SEL = 1.
NCN2612B
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5
MAXIMUM RATINGS
Parameter Symbol Rating Unit
Power Supply Voltage V
DD
0.5 to 5.3 V
DC
Input/Output Voltage Range of the Switch
(Tx, Rx, D, HPD, AUX, IN_, OUT, X)
V
IS
0.5 to V
DD
+ 0.3 V
DC
Selection Pin Voltages (SEL and LE) V
IN
0.5 to V
DD
+ 0.3 V
DC
Continuous Current Through One Switch Channel I
IS
±120 mA
Maximum Junction Temperature (Note 1) T
J
150 °C
Operating Ambient Temperature T
A
40 to +85 °C
Storage Temperature Range T
stg
65 to +150 °C
Thermal Resistance, JunctiontoAir (Note 2)
R
q
JA
37 °C/W
Latchup Current (Note 3) I
LU
±100 mA
Human Body Model (HBM) ESD Rating (Note 4) ESD HBM 7000 V
Machine Model (MM) ESD Rating (Note 4) ESD MM 400 V
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Power dissipation must be considered to ensure maximum junction temperature (T
J
) is not exceeded.
2. This parameter is based on EIA/JEDEC 517 with a 4layer PCB, 80 mm x 80 mm, two 1oz Cu material internal planes and top planes of
2oz Cu material.
3. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
4. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±7.0 kV per JEDEC standard: JESD22A114 for all pins.
Machine Model (MM) ±400 V per JEDEC standard: JESD22A115 for all pins.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020A.
NCN2612B
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6
ELECTRICAL CHARACTERISTICS (V
DD
= +3.3V ±10%, T
A
= 40°C to +85°C, unless otherwise noted. All Typical values are at
V
DD
= +3.3 V, T
A
= +25°C, unless otherwise noted.)
Symbol
Characteristics Conditions Min Typ Max Unit
POWER SUPPLY
V
DD
Supply Voltage Range 3.0 3.3 3.6 V
I
DD
Power Supply Current V
DD
= 3.6 V, V
IN
= GND or V
DD
250 350
mA
DATA SWITCH PERFORMANCE (for both PCIe and Display Port applications, unless otherwise noted)
V
IS
Data Input/Output Voltage
Range
0 1.2 V
R
ON
On Resistance (Tx, Rx) V
DD
= 3 V, V
IS
= 0 V to 1.2 V, I
IS
= 15 mA 8.0 13
W
R
ON
On Resistance (D, HPD, AUX) V
DD
= 3 V, V
IS
= 0 V to 1.2 V, I
IS
= 15 mA 9.0 13
W
R
ON(flat)
On Resistance Flatness V
DD
= 3 V, V
IS
= 0 V to 1.2 V, I
IS
= 15 mA
(Note 6)
0.1 1.24
W
DR
ON
On Resistance Matching
(Tx, Rx)
V
DD
= 3 V, V
IS
= 0 V, I
IS
= 15 mA 0.35
W
DR
ON
On Resistance Matching
(D, HPD, AUX)
V
DD
= 3 V, V
IS
= 0 V, I
IS
= 15 mA 0.35
W
C
ON
On Capacitance f = 1 MHz, Switch On, Open Output 2.1 pF
C
OFF
Off Capacitance f = 1 MHz, Switch Off 1.6 pF
I
ON
On Leakage Current
(IN_/ X/OUT)
V
DD
= 3.6 V, V
IN_
= Vx = V
OUT
= 0 V, 1.2 V;
Switch On to D/HPD/AUX or Tx/Rx; outputs
unconnected
1 +1
mA
I
OFF
Off Leakage Current
(D/Tx/HPD/Rx/AUX)
V
DD
= 3.6 V, V
IN_
= V
X_
= V
OUT_
= 0 V, 1.2 V;
Switch Off; V
D
= V
HPD
= V
AUX
or V
D
= V
HPD
=
V
AUX
set to 1.2 V, 0 V
1 +1
mA
CONTROL LOGIC CHARACTERISTICS (SEL and LE pins)
V
IL
Off voltage input 0 0.8 V
V
IH
High voltage input 2 V
DD
V
I
IN
Off voltage input V
IN
= 0 V or V
DD
1 +1
mA
C
IN
High voltage input f = 1 MHz 1 pF
DYNAMIC CHARACTERISTICS
BR
Signal Data Rate 5 Gbps
D
IL
Differential Insertion Loss
f = 100 MHz 0.7
dB
f = 1.35 GHz 1.3
f = 2.5 GHz 1.9
f = 3.0 GHz 1.9
D
ISO
Differential Off Isolation
f = 100 MHz 54
dB
f = 1.35 GHz 30
f = 2.5 GHz 24
f = 3.0 GHz 22
f = 5.0 GHz 17
D
CTK
Differential Crosstalk
f = 100 MHz 50
dB
f = 1.35 GHz 32
f = 2.5 GHz 27
f = 3.0 GHz 25
f = 5.0 GHz 25
D
RL
Differential Return Loss
f = 100 MHz 20
dB
f = 1.35 GHz 14
f = 2.5 GHz 10
f = 3.0 GHz 6
6. Guaranteed by characterization and/or design.

NCN2612BMTTWG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Analog Switch ICs PCIE/DP SWITCH
Lifecycle:
New from this manufacturer.
Delivery:
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