NOA1305CUTAG Datasheet NOA1305CUTAG | P1-P3

October, 2012 − Rev. 0

1 Publication Order Number:

NOA1305/D

NOA1305

Ambient Light Sensor with

C Interface and Dark

Current Compensation

Description

The NOA1305 ambient light sensor (ALS) is designed for handheld

applications and integrates a 16−bit ADC, a 2−wire I

C digital

interface, internal clock oscillator and a power down mode. The built

in dynamic dark current compensation and precision calibration

capability coupled with excellent IR and 50/60 Hz flicker rejection

enables highly accurate measurements from very low light levels to

full sunlight. The device can support simple count equals lux readings

in interrupt−driven or polling modes. The NOA1305 employs proprietary

CMOS image sensing technology from ON Semiconductor to provide

large signal to noise ratio (SNR) and wide dynamic range (DR) over

the entire operating temperature range. The optical filter used with this

chip provides a light response similar to that of the human eye.

Features

• Senses Ambient Light and Provides an Output Count Proportional to

the Ambient Light Intensity

• Photopic Spectral Response

• Dynamic Dark Current Compensation

• IR Rejection Eliminates Need for Additional IR Photodiode

• Less than 120 mA Active Power Consumption in Normal Operation

• Less than 2 mA Power Dissipation in Power Down Mode

• Interrupt Signal Notifies Host of Significant Intensity Changes

• Wide Operating Voltage Range (2.4 V to 3.6 V)

• Wide Operating Temperature Range (−40°C to 85°C)

• Linear Response Over the Full Operating Range

• Senses Intensity of Ambient Light from 0.165 Lux to Over 100K Lux

• 8 Selectable Integration Times Ranging from 6.25 ms to 800 ms

• No External Components Required

• Built−in 16−bit ADC

• I

C Serial Communication Port Supports Standard and Fast Modes

• Metal Mask Programmable I

C Slave Address Option Available

• These Devices are Pb−Free and are RoHS Compliant

Applications

• Saves Display Power In Applications Such As:

♦ Cell Phones, PDAs, MP3 Players, GPS

♦ Cameras, Video Recorders

♦ Mobile Devices with Displays or Backlit Keypads

CUDFN6

CU SUFFIX

CASE 505AD

http://onsemi.com

VDD

INT

SDA

VSS

SCL

(Top View)

PIN ASSIGNMENT

Device Package Shipping

†

ORDERING INFORMATION

NOA1305CUTAG CUDFN6

(Pb−Free)

2500 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Temperature Range

−40°C to 85°C

NOA1305

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Figure 1. Typical Application Circuit

SDA

SCL

VDD

VSS

Vin = 2.0 to 3.6 V

IC1

NOA1305

MCU

SDA

SCL

all parasitic capacitances

INT

10 m

not to exceed 400 pF including

Figure 2. Simplified Block Diagram

Photo

Diode

Reference

Diode

ADC

SDA

SCL

INT

Osc

C Interface

Control

ADC

Control

C Interface

Table 1. PIN FUNCTION DESCRIPTION

Pin Pin Name Description

1 VSS Ground pin.

2 NC No connection.

3 SCL

External I

C clock supplied by the I

C master. Requires a 1 kW pull−up resistor.

4 SDA

Bi−directional data signal for communications between this device and the I

C master. Requires a 1 kW

pull−up resistor.

5 INT Interrupt request to the host. Programmable active state, open−drain output and requires an external

1kW pull−up resistor.

6 VDD Power pin.

Table 2. ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input power supply VDD 4.0 V

Input voltage range V

−0.3 to VDD + 0.2 V

Output voltage range V

out

−0.3 to VDD + 0.2 V

Maximum Junction Temperature T

J(max)

85 °C

Storage Temperature T

STG

−40 to 85 °C

ESD Capability, Human Body Model (Note 1) ESD

HBM

2 kV

ESD Capability, Charged Device Model (Note 1) ESD

CDM

750 (corner pins), 500 (center pins) V

ESD Capability, Machine Model (Note 1) ESD

200 V

Moisture Sensitivity Level MSL 5 −

Lead Temperature Soldering (Note 2) T

SLD

260 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per EIA/JESD22−A114

ESD Charged Device Model tested per ESD−STM5.3.1−1999

ESD Machine Model tested per EIA/JESD22−A115

Latchup Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78

2. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

NOA1305

http://onsemi.com

Table 3. OPERATING RANGES

Rating Symbol

Standard Mode Fast Mode

Unit

Min Max Min Max

Power supply voltage VDD 2.4 3.6 2.4 3.6 V

Power supply current I

120 120

Quiescent supply current (Note 3) I

DD_qe

2.0 2.0

Low level input voltage (VDD related input levels) V

−0.5 0.3 VDD −0.5 0.3 VDD V

High level input voltage (VDD related input levels) (Note 4) V

0.7 VDD VDD + 0.5 0.7 VDD VDD + 0.5 V

Hysteresis of Schmitt trigger inputs (VDD > 2 V) V

hys

N/A N/A 0.05 VDD − V

Low level output voltage (open drain) at 3 mA sink current

(VDD > 2 V)

0 0.4 0 0.4 V

Output low current (V

=0.4 V) I

3 N/A 3 N/A mA

Output low current (V

=0.6 V) I

N/A N/A 6 N/A mA

Output fall time from V

IHmin

to V

ILmax

with a bus capacit-

ance, C

from 10 pF to 400 pF (Note 4)

− 250 20+0.1C

250 ns

Pulse width of spikes which must be suppressed by the

input filter

N/A N/A 0 50 ns

Input current of IO pin with an input voltage between 0.1

VDD and 0.9 VDD

−10 10 −10 10

Capacitance on IO pin C

− 10 − 10 pF

Operating free−air temperature range T

−40 85 −40 85 °C

3. Current dissipation when a software Power Down command is sent to the device.

4. Cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 400 pF.

Table 4. ELECTRICAL CHARACTERISTICS

(Unless otherwise specified, these specifications apply over VDD = 3.3 V, −40°C < T

< 85°C) (Note 5)

Parameter

Symbol

Standard Mode Fast Mode

Unit

Min Max Min Max

SCL clock frequency f

SCL

0 100 0 400 kHz

Hold time for START condition. After this period, the first

clock pulse is generated.

HD;STA

4.0 − 0.6 −

Low period of SCL clock t

LOW

4.7 1.3

High period of SCL clock t

HIGH

4.0 0.6

Set−up time for a repeated START condition t

SU;STA

4.7 − 0.6 −

Data hold time for I

C−bus devices t

HD;DAT_d

0 3.45 0 0.9

Data set−up time t

SU;DAT

250 − 100 − nS

Rise time of both SDA and SCL (Note 6) t

− 1000 20 + 0.1C

300 nS

Fall time of both SDA and SCL (Note 6) t

− 300 20 + 0.1C

300 nS

Set−up time for STOP condition t

SU;STO

4.0 − 0.6 −

Bus free time between STOP and START condition t

BUF

4.7 − 1.3 −

Capacitive load for each bus line C

− 400 − 400 pF

Noise margin at the low level for each connected device

(including hysteresis)

0.1 VDD − 0.1 VDD − V

Noise margin at the high level for each connected device

(including hysteresis)

0.2 VDD − 0.2 VDD − V

Parameter Symbol Typ Typ Unit

Internal Oscillator Frequency f

osc

1 1 MHz

5. Refer to Figure 3 for more information on AC characteristics

6. The rise time and fall time are measured with a pull−up resistor R

= 1 kW and C

of 400 pF (including all parasitic capacitances).

P1-P3 P4-P6 P7-P9 P10-P12 P13-P13

NOA1305CUTAG

Mfr. #:

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Manufacturer:

ON Semiconductor

Description:

Ambient Light Sensors ALS4.5 RETOOL OSCILLATOR

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NOA1305CUTAG